The air-coolers for processors designed in the so-called “top” form-factor (when the airflow is directed towards the mainboard surface) are about 10 times rarer than the tower-coolers. Even if you take, for example, our reviews, then there will only be one top-cooler review per every ten or so tower-cooler reviews. The reasons are obvious: lower cooling efficiency, or, to be more exact, its greater dependence on the system case and the airflow organization inside it. Moreover, the efficiency difference compared to the tower coolers is so dramatic that the only advantage of the top-coolers, namely the cooling of the components in around-the-socket area, is often not significant enough to make the choice of a top-cooler preferable. Today, Cooler Master Co., Ltd. and Deepcool Industries Co., Ltd. will try to confirm or shatter these statements with their new products. Let’s meet them.
Cooler Master GeminII S524 (RR-G524-18PK-R1)
The first cooler is called GeminII S524. It ships in a cardboard box designed in Cooler Master’s traditional color scheme and style:
The cooler model name and image are on the front of the box, while its technical specifications, description of the key features, dimensions and another photograph are spread over the back and side panels of the packaging:
The cooler sits between the polyurethane foam inserts, which will protect it against transportation mishaps. The accessories including retention kits, thermal paste and installation instructions in 20 languages are neatly packed into an individual smaller box:
The cooler is made in
GeminII S524 is a continuation to the relatively compact GeminII S model and looks very similar to it:
The new cooler became 17.7 mm taller, 20 mm wider and 23.2 mm deeper. Now its dimensions are 105.4 x144.2x144 mm (LxWxD):
As for its weight, it gained only 34 grams reaching a total of 594 g, which is nothing, according to today’s standards :)
As for differences in design, we should definitely mention that the entire heatsink and all heatpipes of this cooler are nickel-plated. There are still five heatpipes 6 mm in diameter. Moreover, the heatsink profile makes this cooler compatible with memory modules featuring tall heat-spreaders:
The heatsink array consists of 62 fins, each 0.4 mm thick and pressed against heatpipes at 2 mm distance from one another. The top of the heatsink is framed with steel plates. The fan is attached to this plate with four retention screws:
If you remove the fan, you will see that when the airflow enters the heatsink, the fin edges haven’t been optimized in any way:
And I think they could use some optimizations, because it is very nearsighted to rely solely on the high fan pressure.
However, when it comes to the cooler base, we couldn’t find any flaws here. The heatpipes are all in special grooves about 1 mm away from one another and are soldered to the base plate: