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InformationX-bit Labs for mobile users! Do not forget that we are running a special version of X-bit Labs web-site for users of mobile and handheld devices: http://pda.xbitlabs.com. Check out our news and articles from smartphones and PDAs to be always updated on the latest computer and technology news. <%BANNER[right_130x600]%>
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Articles: Coolers
Big Typhoon Squared: Cooler Master GeminII Review (page 2)Category: Coolers [ 04/04/2007 | 03:05 PM ] Design FeaturesThe new cooler is designed in a simple but original way. It employs 6 copper heat pipes with an external diameter of 6 millimeters that come out of the copper base and distribute the heat flow in the aluminum heatsink. The same general principle is implemented in the Thermaltake Big Typhoon as well as in the Scythe ANDY Samurai Master that we have tested recently on our site. But let’s take a closer look at the GeminII: It is large, isn’t it? The heatsink measures 175 x 124.6 x 81.5 millimeters making it the largest heatsink of all top-design coolers. It weighs 847g and is going to be over a kilogram with two fans installed. Two parts can be seen in the aluminum heatsink. In the central part the ribs are soldered to the copper base: The rest of the ribs just hang on the heat pipes. Take note that the bottom edge of this group of ribs has a wavy profile, making a wave in the place of contact with the heat pipes, i.e. in the place where the main thermal load is distributed. I think this is a clever solution. There is a hole in the middle of the ribs soldered to the base which is meant to reduce resistance to airflow and to minimize the heatsink’s weight. The whole heatsink arrangement is covered from above with an aluminum frame. The frame is secured with screws on the side ribs: The frame has X-shaped bars to make it more rigid. I don’t think they are really necessary for that purpose because the sides are curved in and the load is low here, while these bars do create some additional resistance to airflow. <%BANNER[banner_468x30]%>
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Category NewsCategory: Coolers Thursday, June 26, 20085:20 pm Coolink Unveils Thermal Compound with Ceramic Nano-Particles. Thermal Grease with Ceramic Nano Particles Approaches the Market Friday, June 6, 200811:10 am IBM Touts New Liquid-Cooling Technique. IBM to Use Liquid to Cool 3D Chips Tuesday, March 11, 20084:05 pm OCZ Technology Launches Vendetta 2 CPU Cooler. Vendetta Grew Up Wednesday, August 15, 20072:13 pm New Chip-Cooling Technology Promises a Revolution. Ionic Winds for Locally Enhanced Cooling Thursday, May 10, 20073:35 pm OCZ Vindicator: Scythe Ninja Clone or New Proprietary Design? OCZ and Scythe Officials Argue All Latest News <%BANNER[right_130x130_1]%>
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