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Package and Accessories

The new Cooler Master solution ships in a large black box with a big cooler photo on the front side of it and detailed specifications on the back:

 

Besides a large tag on the box top telling the potential owners about LGA 1366 platform support, there is also a large sticker announcing new ThermalFusion 400 thermal interface bundled with V10. The accessories bundle includes everything necessary to install this cooling solution on any of the contemporary platforms:

  • Retention kit and backplate for LGA 775 mainboards;
  • Retention kit and backplate for LGA 1366 mainboards;
  • Retention kit and backplate for Socket AM2(+) mainboards;
  • Warranty slip;
  • 1g pack of ThermalFusion 400 thermal interface;
  • A set of screws, rubber rings, plastic washers, screw-nuts and a wrench for them;
  • A manual on the TEC module;
  • Installation instructions in multiple languages.

I would like to specifically dwell on ThermalFusion 400 thermal interface sealed in a small plastic packet with a small promotional booklet:

Unfortunately, this booklet contains no useful info, just marketing slogans with general phrases promising high cooling efficiency and other advantages. When we finished this review, there was still no information about this thermal interface on the official company web-site. We are not going to talk about efficiency of this thermal compound in our today’s review to keep you intrigued for a while, however, ThermalFusion 400 will be included in our next roundup of thermal interfaces.

 
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