Another highly efficient cooler that will participate in our today’s test session is ThermoLab BARAM:
The sample we got didn’t have the retention kit for LGA1366 platform included with the bundled accessories that is why they sent it to us separately:
A small plastic bag contained a universal backplate, installation instructions, washers, two sticky pads of different thickness, retention panels and screws:
The entire installation procedure for the LGA1366 mainboards requires attaching the retention panels to the base of the cooler and fastening them on the board with screws tightened to the backplate through the PCB:
However, there is one very important peculiarity. The thing is that the metal backplate is not flat – its corners are a little curved to one side. It means that if you install the backplate not the way the manual advises, but with the backplate corners bent away from the PCB, the cooler will be pressed harder against the processor heat-spreader, which should ensure much better heat transfer. Moreover, do not forget to stick a thin pad to that part of the backplate that will be pressed against the original mainboard backplate. This will add a few extra millimeters to the distance between the backplate and the board and thus increase the pressure even more. Air-cooling maniacs may use a thick pad instead; however, you will need to push hard against the cooler during installation in this case.
This is what ThermoLab BARAM looks like installed into a system case:
Overall, there is nothing else I could add here, so let’s move on to the next candidate.