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Dynatron Corporation was founded in Taiwan almost 12 years ago, back in 1991. Specializing on computer components cooling right from the start, Dynatron engineers invented the so-called MicroFin technology that according to them, is currently being used for production of majority of cooling systems. At this time, the company offers a wide range of coolers, fans, blowers, passive heatsinks, liquid-cooling systems and numerous accessories. However, we were particularly interested in only two solutions: EVO-11 and G950, which we are going to discuss today in our new review.

Dynatron EVO-11

The name of the new EVO-11 cooler comes from the word “Evolution” and clearly indicates that it is about some evolutionary development of a CPU cooling system. All sides of a relatively small cardboard box are covered with information, including a photo of the cooler, description of its key features, specifications, etc.:

 

Inside the box you find a plastic blister holding the cooler and accompanying accessories. The accessories bundle includes three retention kits for LGA775/1366 and Socket AM2(+)/AM3 platforms, retention screws and installation manual:

Dynatron EVO-11 really differs from most CPU coolers. But it is not its size (122 x 108 x 157 mm) or its weight (688 g) that are different, but its heatsink design. Let’s take a closer look at the cooler:

 

Well, it looks like a regular tower at first glance, but then you notice that this tower is shifted away from the central axis of the cooler. In fact, only the fan is hanging above the cooler base, while the entire heatsink is shifted forward:

Dynatron EVO-11 is designed with seven copper heatpipes 6 mm in diameter. The cooler heatsink consists of 53 aluminum plates pressed firmly against these heatpipes:

 

Each heatsink plate is 0.45 mm thick and they are spaced out at 1.8 mm from one another. The calculated effective heatsink surface is 6,110 cm2, which is in fact pretty average for contemporary tower coolers.

One of the key peculiarities of Dynatron EVO-11 is the two-layer heatpipes structure in the base: four heatpipes in the lower layer and three in the top one:

Heatpipes lie in special grooves and are soldered to the base plate, as we can tell from the traces of soldering alloy on the edges. But it is not the most important observation here. It turns out that all three base plates are made of … aluminum! I have to admit that it is really hard to imagine, because thermal conductivity of aluminum is 1.88 times lower than thermal conductivity of copper and I couldn’t recall when we last tested a cooler with an aluminum base in our lab. But unfortunately, this fact is undeniable. Besides, take a look at how big of a gap there is between the top and the bottom layer of heatpipes. Considering comparatively low thermal conductivity of aluminum, it makes the top heatpipes layer more decorative than functional.

 
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