Articles: Cooling
 

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Design and Functionality

So, here they are – the early representatives of the new step in the evolution of the direct-touch technology.

  

The EVGA Superclock differing from the Swiftech Polaris 120 in two things only, namely the fan and the black color of the heatsink, I will be talking about the Polaris 120, referring to the Superclock where necessary.

So, it is a tower-design heatsink that has five copper heat pipes, 8 millimeters in diameter, in its base. There are aluminum fins on those pipes.

 

 

The heatsink measures 152x135x91 millimeters.

 

The two coolers differ in weight. The Superclock is 867 grams and the Polaris 120 is 849 grams. The difference must be due to the weight of the fans and the black paint of the EVGA cooler.

The heatsinks are assembled properly. The fins do not wobble on the pipes. Even the top decorative plate sits firm. There are a total of 46 fins. They are 0.5millimeters thick and 2 millimeters apart from each other.

  

For all its simplicity, the heatsink has two original features. The first one is that the heat pipes are placed in such a way that the three central ones, which do the bulk of work, are in the middle of the fan’s air flow. Here is a picture to illustrate this:

As you can see, the heat pipes do not overlap and do not block the air flow for each other. This is good in terms of achieving maximum cooling performance.

Besides, the engineers focused the air flow in the hottest part of the heatsink by making an egg-shaped hole in its center:

As a result, the stream of air from the fan splits up in two and goes along that part of the heatsink fins where the heat pipes are located.

The center hole with blank walls helps focus the air flow in the hottest part of the heatsink and thus make the most efficient use of the air supplied by the fan. This is the heatsink’s second special feature. The edges of the fins are serrated to reduce their resistance to the incoming air whereas the surface is convex. The total heatsink area is no larger than 6200 sq. cm, which is not much by today’s standards and may be insufficient for cooling a high-TDP CPU.

 
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