Articles: Cooling

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Design and Functionality

I have to say right away that Scythe Kabuto doesn’t look anything like a samurai helmet, so don’t try to wear it as one: it will not hold (only if you use some flexible ties or sticky tape) and will not protect you against any blow to the head. However, it looks very much like other top-coolers, i.e. the solutions designed with the airflow aimed at the mainboard PCB:


The cooler measures 124 x 133 x 132 mm and weighs 730g. It uses 6 copper heatpipes, each 6mm in diameter, that come out of one side of the cooler base.

The heatpipes hold three heatsink arrays, each made of 53 plates. The distance between two closest plates is 2mm and each plate is 0.35mm thick. The splitting of the cooler heatsink into several individual sections is called M.A.P.S. (Multiple Pass-Through Airflow Structure) and is supposed to lower the airflow resistance. It should also ensure fast dissipation of heat from the area around the heatpipes, which improves the efficiency of each heatsink array and the entire heatsink in general.

Our tests showed that this technology is extremely efficient in Scythe Mugen 2 with the heatsink built following the same principle. Moreover, it is evident that the production cost is way lower when the heatsink is built out of small plates rather than large plates, like by the competitor solutions (this is, probably, why the recommended pricing of both, Scythe Mugen 2 and Kabuto, is so low). Also, note that the heatpipes pierce the heatsink arrays on two levels, which allows to better distribute the heat more evenly over the heatsink.

The calculated effective heatsink surface (including the lower aluminum heatsink measuring 50 x 76 x 43 mm) is 7, It is very good even for a tower-cooler, not to mention the top-designs, of course.

To ensure sturdiness of the whole structure, the heatsink arrays are connected with each other by means of small pieces of 12 plates. The frustrating thing is that the side plates are not sitting tight on the heatpipes and threaten to come off them. Too bad that the plates are simply pressed against the heatpipes, and not soldered to them.

The base of the helmet-cooler has no anticipated grooves for the heatpipes. They used thermal glue for them instead of the soldering technique:


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