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InformationX-bit Labs for mobile users! Do not forget that we are running a special version of X-bit Labs web-site for users of mobile and handheld devices: http://pda.xbitlabs.com. Check out our news and articles from smartphones and PDAs to be always updated on the latest computer and technology news. <%BANNER[right_130x600]%>
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Articles: Coolers
Brother against Brother: Thermaltake Big Typhoon vs. Thermaltake MaxOrb (page 3)Category: Coolers [ 04/19/2007 | 09:02 AM ] DesignThere is not much new, let alone revolutionary, in the MaxOrb design. The changes it brings into the well-known Orb series should rather be regarded as a deep modification. The shape of the cooler’s heatsink hasn’t changed much and remains a ribbed bowl with a fan in the center: The bowl is rather large in diameter at 144 millimeters, so the manufacturer easily placed a 120mm fan into it. What is the most surprising thing, the cooler weighs only 465 grams with all its large dimensions! For comparison, the Big Typhoon is as heavy as 813 grams while its modernized VX version, 822 grams. But as soon as you turn the MaxOrb upside down, you realize that Thermaltake’s engineers have finally set themselves to work and come up with something truly new and original (they took 3 years to do that, by the way :)): So, there are six 6mm copper heat pipes going out of the nickel-plated copper base. Each pipe makes up a semicircle in its separate tier of aluminum ribs, distributing heat flow among them. The manufacturer’s “Tt” logo is pressed out in the outermost (tallest) row of the ribs. This row is also reinforced with a rigidity rib that additionally enlarges the heat dissipation area. The edges of the ribs are processed so that you didn’t cut your fingers on them. The ends of the pipes meet in the horizontal mounting block. This makes the whole arrangement robust because the heatsink actually hangs on the heat pipes: There is a total of 142 aluminum ribs hanging on the outermost pipes. There are fewer of them on the internal tiers. <%BANNER[banner_468x30]%>
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Category NewsCategory: Coolers Thursday, June 26, 20085:20 pm Coolink Unveils Thermal Compound with Ceramic Nano-Particles. Thermal Grease with Ceramic Nano Particles Approaches the Market Friday, June 6, 200811:10 am IBM Touts New Liquid-Cooling Technique. IBM to Use Liquid to Cool 3D Chips Tuesday, March 11, 20084:05 pm OCZ Technology Launches Vendetta 2 CPU Cooler. Vendetta Grew Up Wednesday, August 15, 20072:13 pm New Chip-Cooling Technology Promises a Revolution. Ionic Winds for Locally Enhanced Cooling Thursday, May 10, 20073:35 pm OCZ Vindicator: Scythe Ninja Clone or New Proprietary Design? OCZ and Scythe Officials Argue All Latest News <%BANNER[right_130x130_1]%>
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