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Besides, the testers and overclockers will definitely be happy with the POST controller in the upper left corner of the PCB that quickly detects and recognizes the issues occurring during system boot-up.

One of the most interesting peculiarities of this mainboard that we come across for the first time is the voltage regulator with the digital feedback that uses no electrolytic capacitors. This modules is designed as a six-phase circuitry, it uses high-frequency MOSFET and small ceramic SMT capacitors.

Note that transistors of this type are remarkable for their relatively high operational temperatures, therefore they are covered with an aluminum heatsink. This heatsink may get pretty hot during work if there is no appropriate cooling airflow from the processor fan.

It is a pity that having switched to progressive processor voltage regulator design DFI has given up capacitors with hard-bodied polymeric electrolyte. Although there are no electrolytic capacitors in the processor voltage regulator circuitry, there are quite a few of them on DFI LANParty UT ICFX3200-T2R/G PCB.

The chipset North and South Bridges are cooled down with passive heatsinks, which makes DFI LANParty UT ICFX3200-T2R/G completely fanless.

It is partially explained by the fact that ATI RD600 is manufactured using 90nm process, so the heat dissipation of the chip has been lowered significantly. Nevertheless, passive cooling may not be enough for overclocking when you increase the voltage on the chipset North Bridge. In the nominal operation mode the maximum North Bridge temperature didn’t go beyond 70o C, however during overclocking it heated up to 95o C+, which is a clear indication that more efficient chipset cooling is required.

And this shouldn’t be a problem as DFI LANParty UT ICFX3200-T2R/G offers a lot of connection options for additional fans. There are five corresponding connectors on the PCB, besides the processor fan connector. Also thanks to the ITE IT8718F hardware monitoring controller the mainboard allows managing the rotation speed of three fans depending on the temperature of different system “hot spots”.

 
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