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Articles: Mainboards

DFI LanParty UT RDX200 CF-DR Mainboard on ATI Radeon Xpress 200 CrossFire Chipset (page 5)


Category: Mainboards

by Ilya Gavrichenkov

[ 01/20/2006 | 07:14 PM ]


Real-time Pricing and Availability:

DFI LANPARTY UT RDX200 CF-DR Motherboard Products

Pages : 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 | 16 | 17 | 18

PCB Design

We have already pointed out that DFI LanParty UT RDX200 CF-DR impressed us with its stylish looks, especially when the system is running in ultra-violet light. However, the remarkable exterior design is not the only unique feature of the DFI platform. It also stands out due to its unusual components layout.

The first thing that catches your eye is the location of the DIMM slots that have been moved behind the processor socket, while the CPU voltage regulator circuitry remained in front of the Socket 939, where the memory slots have always been. It is really hard to say what inspired this particular layout decision. Especially since the reference design of the Radeon Xpress 200 CrossFire implies pretty common components location. I don’t think that there are any significant disadvantages about this layout solution. The only thing I am a little bit concerned with is the fact that in this case the memory modules get into a warmer zone inside the system, which theoretically can affect their overclocking potential.

As for the CPU voltage regulator, the current layout allowed engineers to locate both CPU power connectors in front of the Socket 939. This is actually very convenient, because the power cables leading to the mainboard do not hang in the way of any vital air streams. Moreover, the distance to the PSU is minimal, which is also very good.

I would like to mention that the DFI LanParty UT RDX200 CF-DR mainboard is equipped with the 24-pin and 8-pin ATX power supply connectors, but it can work just fine even with the outdated 20-pin and 4-pin cables.

The CPU voltage regulator on DFI LanParty UT RDX200 CF-DR features 4-channel design. It leaves the impression of a very thoroughly designed quality circuitry. The MOSFETs are equipped with passive aluminum heatsinks. The coils are all in plastic casings. DFI used high-quality capacitors from the Japanese Chemi-Con Company that is known as a high-end electronic components manufacturer.

The chipset North Bridge is cooled down by a small active cooler, and the South Bridge is equipped with a passive heatsink. Unfortunately, the chipset cooler is not efficient enough. The matter is that its cooling surface is too small to ensure proper cooling of the chip, so the fan speeds up to 7,000rpm. Of course, no silent operation is possible at this fan rotation speed, even though it is built with magnetic bearings.

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