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Closer Look: G.SKILL F1-4000USU2-2GBHZ

We will start with G.SKILL -4000USU2-2GBHZ kit. This is PC4000 (DDR500) memory with the nominal timing settings of 3-4-4-8 (for dual-channel mode).

The manufacturer recommends using these memory modules with Socket 939 mainboards based on nForce chipset family designed by such companies as DFI, MSI, EPoX.

The first impression you get when you take these memory modules is that it is a very decent high-quality solution. A quick first look at the DIMMs proves that these modules are built on the best overclocker PCBs – Brainpower B6U808 (note that practically all G.SKILL memory modules are built on this PCB).

The solution is hidden between two black anodized heat-spreader plates pressed together with two steel clips. The company logo is put in the center of these heat-spreaders. Each memory modules has a sticker that carries almost all the necessary technical details about it. Why almost? Well, no one can say right away what memory chips are used for this solution. The manufacturer’s website claims that these are Samsung chips, although no further details are available. I decided to double-check whether this was true and removed the heat-spreaders. At first it seemed like an easy task: just remove the steel clips. However, I had to really apply some effort to safely remove one heat-spreader plate from the memory chips.

In case you decide to undertake the same investigation, please, keep in mind that if you damage the memory module sticker (and one of them goes over one of the steel clips), you will automatically lose your warranty. But even if the sticker remains virgin, you will still have visible scratches – the traces of removed clips on the glossy heat-spreader surface.

Therefore, you will have to believe the manufacturer and myself and avoid satisfying your curiosity at this relatively high expense.

Ok, I can say now that there were UCCC memory chipset from Samsung under the heat-spreaders:

The only significant drawback that catches your eye even if you refrain from removing the heat-spreaders is the thermal pad between the memory chips and the heat-spreader plate that is supposed to conduct heat from the chips into the heat-spreader. This pad is very narrow and doesn’t cover even 50% of each memory chip:

In this case it can hardly play the designated role efficiently enough…

This winds up the discussion of the first kit features and design peculiarities.

 
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