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G.Skill TridentX F3-2400C10Q-32GTX

G.Skill’s flagship overclocker-friendly products are marketed under the TridentX trademark. Besides extreme specs and a special version of aluminum heatsinks, this series differs from other DDR3 SDRAM in some more ways. The TridentX series was launched along with the Intel Z77 platform, its visiting card being the transformer heatsinks that can change their size and appearance.

Consisting of four 8GB modules of DDR3-2400 SDRAM, the G.Skill TridentX F3-2400C10Q-32GTX has the same packaging as other G.Skill products. It is shipped in a dual-sided blister wrap.

The heatsinks of the TridentX series are completely different from other solutions from G.Skill. Neatly manufactured, they are rather heavy, even though made of aluminum. The bottom part of each heatsink that covers the DDR3 SDRAM chips is a pair of thick black-colored bars with a rough surface. The top part is a red aluminum superstructure with a complex profile stylized as tongues of flame.

It is not the impressive looks but the transformability that is the key feature of these heatsinks. G.Skill listened to user complaints that tall heatsinks had poor compatibility with massive CPU coolers, so the top (red) part of the heatsink can be removed by unfastening two screws. As a result, the total height of a TridentX module is decreased from 54 to 40 mm, allowing to choose between aesthetics and practicality. In their shortened version, the TridentX modules won't conflict with regular large-size CPU coolers.

The shortened heatsink is quite sufficient to cool the eight memory chips on both sides of each module. The G.Skill TridentX F3-2400C10Q-32GTX modules aren’t very hot as they are based on 30nm DDR3 SDRAM chips. The top temperature we spotted during our tests was 53°C.

Rated for 2400 MHz, these modules have the same components as the 2133MHz RipjawsZ F3-2133C9Q-32GZH. So, it is all about choosing the best chips. The TridentX employs the same SEC HCH9 components but from a different batch. Thanks to their high overclocking potential and low heat dissipation, these chips have a good reputation and are deservedly employed in high-speed memory modules. The PCB is manufactured by BrainPower again. Each 8GB module has a total of 16 chips, 4 gigabits in capacity each.

The official specs of the TridentX F3-2400C10Q-32GTX kit are as follows:

  • 32 GB Dual-channel kit consists of four memory modules, 8 GB each;
  • Nominal frequency: 2400 MHz;
  • Timings: 10-12-12-31-2T;
  • Supports XMP;
  • Voltage: 1.65 V.

The voltage is increased to the maximum limit permitted for Intel’s DDR3 SDRAM controllers, which is normal for high-speed memory. The good news is that the TridentX F3-2400C10Q-32GTX features rather low timings. That’s especially good considering that it’s a 4-piece memory kit.

The high clock rate and CL10 timings narrow the scope of compatible mainboards. G.Skill guarantees the TridentX F3-2400C10Q-32GTX will work with some two dozen Z77-based mainboards from ASUS, Gigabyte and MSI, but we guess there won’t be problems with many other products as well. To simplify installation, these modules support XMP 1.3. The single XMP profile (it is duplicated for more stability) contains the same clock rate, voltage and timings as you can see in the official specs. Considering that the Ivy Bridge memory controller is flexible and easy to configure, launching this memory at 2400 MHz won’t be a problem at all. You won’t have to do any setting up with this memory kit but their SPD unit contains DDR3-1333 settings just in case.

All TridentX F3-2400C10Q-32GTX modules under presale testing at the manufacturer’s facilities and come with a lifetime warranty.

 
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