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Kingston HyperX T1 KHX1866C9D3T1K2/8GX

Now let’s take a look at the flagship T1 subseries of the HyperX series of Kingston memory modules. Rated for extremely high operating frequencies, T1 modules feature high-efficiency heatsinks that have a large heat dissipation area.

Well, talking about the specific product, the Kingston HyperX T1 KHX1866C9D3T1K2/8GX kit cannot boast extraordinary specs. Being one of the junior models in the HyperX T1 series, it is rated for DDR3-1866 mode, just like the above-discussed HyperX Genesis KHX1866C9D3K2/8GX.

The label on the memory sticks you can see in the photo reads “KHX18C9T1K4/16X”, meaning that these modules used to be part of a quad-channel kit with a total capacity of 16 gigabytes. However, the kit was later transformed into two dual-channel kits, therefore we refer to it as “KHX1866C9D3T1K2/8GX”. There is absolutely no difference between DDR3-1866 modules of the T1 series that are part of dual- and quad-channel kits, so this substitution is justifiable.

Here are the official specifications of the Kingston HyperX T1 KHX1866C9D3T1K2/8GX memory kit:

  • Dual-channel kit consists of two memory modules, 4 GB each;
  • Nominal frequency: 1866 MHz;
  • Timings: 9-11-9-27;
  • Voltage: 1.65 V.

It is easy to see that the HyperX T1 KHX1866C9D3T1K2/8GX has the same specs as the HyperX Genesis KHX1866C9D3K2/8GX, so their prices are comparable as well. The T1 series kit is just a couple of dollars more expensive.

So, it is not the specs but other factors that differentiate the mentioned products. First of all, the T1 kit features more advanced cooling than the simple, even though cute-looking, Genesis heatsinks. The comb-shaped aluminum heatsinks of the T1 kit have a number of grooves in their surface, so the total heat dissipation area is much larger compared to that of the Genesis kit. Obviously, they are going to be much more efficient at cooling DDR3 SDRAM chips. Like the Genesis heatsinks, the T1 ones are painted blue and bear Kingston and HyperX logos.

It goes without saying that the T1 series cooling is highly efficient, yet we generally dislike such heatsinks because they are tall (the T1 heatsinks increase the height of the memory modules from the standard 30 to 61 millimeters, for example) and may provoke some problems as you're assembling your system. They may conflict with CPU coolers, preventing you from installing a high-efficiency large cooler on your CPU. Such modules can only be inserted into the DIMM slot which is the closest to the CPU if the latter’s cooler is compact, like the boxed one. And the irony of the situation is that there is no real need for such cooling because DDR3 SDRAM is manufactured on progressive technologies and has a low level of heat dissipation.

There is one more difference between the HyperX T1 KHX1866C9D3T1K2/8GX and the HyperX Genesis KHX1866C9D3K2/8GX. It is about the memory chips they use. The heatsinks of the T1 kit rather unexpectedly conceal Hynix H5TC2G83CFR-H9A chips which are actually classified as DDR3L. It means that these chips are supposed to work at a voltage of 1.35 rather than at 1.65 volts as set by Kingston. The increased voltage is the only way to make such chips work at 1866 MHz.

Thus, the HyperX T1 KHX1866C9D3T1K2/8GX and the HyperX Genesis KHX1866C9D3K2/8GX are two quite different products inside, but it only shows up in overclocking experiments. The specs and XMP profiles of these kits coincide. In both cases we have two XMP profiles: DDR3-1866 mode with 9-11-9-27 timings and DDR3-1600 with 9-9-9-27 timings.

Like the rest of the HyperX series, this kit is factory-tested (at 1866 MHz with the default timings) and comes with a lifetime warranty.

 
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