Articles: Memory
 

Bookmark and Share

(0) 
Pages: [ 1 | 2 | 3 | 4 | 5 ]

In fact the manufacturers of overclocked memory modules may face some real problems in the nearest future. There is a rumor that Samsung may discontinue DDR TCCD memory chips with low latencies and assign the production capacities with well-established manufacturing technologies to DDR2 and XDR. As a result, OCZ and other companies will have only Micron chips to go for. Micron however, may take advantage of this situation and help Crucial take over most of this market this way.

By the way, why should Samsung be so focused on the DDR anyway? In March the company announced that they finished the development of their 512Mbit DDR3 chip, though it will appear in the market no sooner than next year and we will be able to seriously regard the DDR3 market only in 2007. In fact, this is somewhat frustrating, because the whole thing looks very attractive: the new 80nm chip is expected to work at 1066MHz frequency and only 1.5V voltage. Moreover, its power consumption should get 40% lower compared with what the current DDR2 chips working at 1.8V consume.

As for DDR2, Infineon was the No 1 company in February here. They introduced their 4GB DDR2 memory module. You may find nothing so excitingly new about it in general, except for one fact: it was only 4.1mm thick, which is a true record for monsters like that. Of course, they managed to achieve this impressive module thickness (or thinness, I should say :) ) due to MCP chips. The MCP memory technology implies that there are more than one die inside a single package. In Infineon’s case there were two 1Gbit DDR2 SDRAM chips.

Samsung went even further in terms of the memory chips capacity. In the end of February the company announced that they were beginning the production of their 2.5Gbit MCP chips with the record-breaking capacity of 2.5Gbit. Note that this is the mass production capacity. In fact, Samsung also demonstrated 3.2Gbit MCP chip. Here, however, we are talking about a “mixed’ solution: there are two 1Gbit NAND flash chips and two 256Mbit Mobile DRAM chips in a single package. This way, you can immediately guess what the market for these solutions would be: 3G cell phones. As soon as they acquire new services and functions (especially video) they should theoretically require quite a bit of memory, that’s why such memory amounts can be demanded.

 
Pages: [ 1 | 2 | 3 | 4 | 5 ]

Discussion

Comments currently: 0

Add your Comment