Thermal Performance

We tested this solution according to the methodology described in our recent article called Foxconn System Cases Roundup with a few small differences. The case turned out too big and it wouldn’t fit into the incubator chamber. So we had to test it in a room, where the temperature was maintained constant with the air conditioner. :)

The tests were run at 23^oC, the temperature deviations didn’t exceed 0.5^oC throughout the entire test session. The room temperature was constantly controller with the electronic Fluke 54 II thermometer.

The system was configured as follows:

• ASUS P4C800-E rev.2.0 mainboard (BIOS 1016);
• Intel Pentium 4 3.4GHz CPU;
• Intel Box cooler;
• 2x256MB OCZ OCZ433512ELDCPE-K;
• Sapphire ATI RADEON X800 PRO 256MB graphics card;
• Maxtor MaXLine Plus II 250GB hard disk drive;
• 3.5” Sony MPF920-E floppy drive;
• LG GCR-8523B CD-ROM.

Here are the results we obtained:

And here comes the diagram:

Well, the design of this system case suggests that it is targeted for gamers, so it will definitely be stuffed with some high-end powerful hardware, similar to what we used in our tests today. That is why I believe that we managed to emulate the actual workload the case will have to go through in real life.

The CPU and the HDD are cooled down very well, and the other devices maintain normal thermal mode.