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I get the feeling the massive heat is related to manufacturing and nothing to do with the architecture itself.
Take note of the upcoming P4s that use the new manufacturing processes. Their Typical heat Production is above 100W.
By applying the same technique to other chips, you'll see them get hotter.
There must be some manufacturing issue Intel is facing.
For mobile applications, 45W is a bit too high. I guess this is where Transmeta and VIA's EPIA will start eating more into the market.
Recall a 1.1Ghz Efficeon CPU is = Pentium-M ULV 900Mhz in performance. The P-M ULV 900Mhz just barely edges out in performance (1% difference).
Transmeta has to push out their products into the market when the right time comes. (In this case, when Intel is too busy stumbling around with its manufacturing issues with smaller cores...less than 65nm.)
Take note of the upcoming P4s that use the new manufacturing processes. Their Typical heat Production is above 100W.
By applying the same technique to other chips, you'll see them get hotter.
There must be some manufacturing issue Intel is facing.
For mobile applications, 45W is a bit too high. I guess this is where Transmeta and VIA's EPIA will start eating more into the market.
Recall a 1.1Ghz Efficeon CPU is = Pentium-M ULV 900Mhz in performance. The P-M ULV 900Mhz just barely edges out in performance (1% difference).
Transmeta has to push out their products into the market when the right time comes. (In this case, when Intel is too busy stumbling around with its manufacturing issues with smaller cores...less than 65nm.)
[Posted by: 222 | Date: 01/26/04 07:25:02 PM]
