News Archive

October, 2006
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Tags

45nm AM3 AMD ATI Atom Blu-ray Chipsets Core i7 Deneb Failures Fujitsu Geforce Heka IBM Intel MSI Microsoft Nehalem Nforce Nvidia PSP Phenom Playstation Radeon Regor SSD Samsung Shanghai Sony Xbox

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News

Tuesday, October 31, 2006

Corsair Puts Innovative Heat-Sinks onto Performance-Mainstream Modules.

[10:10 pm]

Corsair Installs Dual-Path Heat Exchange “Dominator” Coolers on PC2-6400

AMD Slashes Opteron Pricing.

[2:12 pm]

AMD’s Opteron Chips Become More Affordable

Consumer Electronic Companies Get Rid of Wires with WirelessHD.

[12:58 pm]

Leading Consumer Electronics Companies Co-Develop WirelessHD

Rydermark Set to Challenge 3DMark.

[11:25 am]

New Software Suite for Testing Graphics Cards Coming

AMD Touts “Fusion” Platforms – CPU/GPU Silicon to Become Available in 2008.

[9:05 am]

AMD Discloses Details of CPU/GPU Designs

IBM Demos Next-Gen Cooling Technologies.

[7:56 am]

IBM Proposes Direct Water Cooling for Chips

AMD’s x86 Microprocessor Market Share Continues to Soar.

[4:45 am]

AMD, Intel Solidify Positions, Change Roles