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News

Monday, December 10, 2012


TI Expands Development of Wireless Power Technologies. Texas Instruments TI A4WP Qi Samsung Qualcomm
[11:55 pm]

TI Joins A4WP Wireless Power Alliance

Huawei Establishes R&D Center in Finland. Huawei
[9:46 pm]

Huawei Invests €70 Million to Boost R&D in Finland

Toshiba's STT-MRAM Memory Element Promises World's Best Power Consumption . Toshiba STT-MRAM MRAM SRAM
[9:32 pm]

Toshiba’s New Chip Cuts Power Consumption of Mobile Processor by Two-Thirds

IBM Announces Silicon Nanophotonics Breakthrough. IBM 90nm Semiconductor Nanophotonics
[6:05 pm]

IBM Finds Way to Build Silicon Nanophotonics into Chips

Valve Pre-Announces Its Own-Brand Game Console. Valve Valve Software Steam Microsoft Xbox Sony Playstation Nintendo Wii Wii U
[12:00 am]

Head of Valve Mulls Benefits of Own Hardware

Showa Denko Set to Begin Roll-Out Seventh-Generation PMR Platters for High-Capacity HDDs in 2013. HDD Showa Denko Toshiba Seagate WD Western Digital
[12:00 am]

Showa Denko’s Ultra High-Capacity to Enable Multi-Terabyte Hard Drives for Notebooks

Chief Executive of AMD: We Are Not Interested in Low-Volume Customers. AMD Semiconductor 28nm 40nm 55nm Globafoundries TSMC Business
[12:00 am]

AMD Interested Only in High-Volume Design Wins

Intel: Transition to 450mm Will Terminate Half of Semiconductor Market Players. Intel Semiconductor ASML 450mm
[12:00 am]

Numerous Transitions Incoming This Decade Will Reduce the Number of Semiconductor Companies - Paul Otellini

 

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