News Archive

March, 2013
     12
3
4
56789
10
111213141516
17
1819202122
23
24
2526272829
30
31      
< Feb, 2013 Apr, 2013 >
 

News

Monday, March 4, 2013


LSI First to Ship New High-Performance SAS-12Gb/s Products. LSI  SAS  RAID  HDD
[10:59 pm]

LSI Begins to Ship 12Gb/s SAS RAID-on-Chip and I/O Controllers

President of ARM Foresees 16-Core, 32-Core Chips for Smartphones. ARM  Cortex  ARMv8  Samsung  Qualcomm  Mediatek  Big.Little
[10:58 pm]

Simon Segars: Moore’s Law Will Enable Cost-Efficient Multi-Core ARM Chips

Toshiba Develops Intelligent Wearable Vital Signs Sensor Module. Toshiba  Silmee
[10:58 pm]

Toshiba’s Wearable Module Senses Cardio Gram, Pulse, Body Temperature and Movement

HP’s Project Moonshot Servers to Get ARM Chips from Texas Instruments. HP  Hewlett-Packard  Moonshot  KeyStone  TI  Texas Instruments  ARM  Cortex  Calxeda
[10:57 pm]

HP’s Microservers Based on ARM Architecture to Use TI KeyStone II SoCs

Intel Rolls-Out Atom CE5300 Processor for NAS Devices. Intel  Atom  Asustor  Synology  Thecus  NAS
[10:39 pm]

Intel Introduces New Atom Chips for NAS

Smartphones Expected to Outship Feature Phones for First Time in 2013 – IDC. Android  Google  Samsung  LG  LG Electronics  Apple  HTC  ZTE  Nokia  Sony
[9:44 pm]

Demand for Smartphones to Shift to Emerging Markets

AMD Begins to Send Software Developers Next-Generation APUs. AMD  Fusion  Kaveri  Kabini  Steamroller  Jaguar  x86  PlayStation  Xbox Next  Orbis  Durango  Radeon  GCN
[6:02 pm]

AMD Starts to Provide Its Next-Gen Fusion APUs to Software Developers

Sony Wants to Become World’s No. 3 Maker of Smartphones. Sony  LG Electronics  Nokia  HTC  Huawei  ZTE  Samsung  Apple
[10:15 am]

Sony Intends to Become the Third Largest Smartphone Maker in the World