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News
Monday, March 4, 2013
LSI First to Ship New High-Performance SAS-12Gb/s Products.
[11:59 pm]
LSI Begins to Ship 12Gb/s SAS RAID-on-Chip and I/O Controllers
President of ARM Foresees 16-Core, 32-Core Chips for Smartphones.
[11:58 pm]
Simon Segars: Moore’s Law Will Enable Cost-Efficient Multi-Core ARM Chips
Toshiba Develops Intelligent Wearable Vital Signs Sensor Module.
[11:58 pm]
Toshiba’s Wearable Module Senses Cardio Gram, Pulse, Body Temperature and Movement
HP’s Project Moonshot Servers to Get ARM Chips from Texas Instruments.
[11:57 pm]
HP’s Microservers Based on ARM Architecture to Use TI KeyStone II SoCs
Intel Rolls-Out Atom CE5300 Processor for NAS Devices.
[11:39 pm]
Intel Introduces New Atom Chips for NAS
Smartphones Expected to Outship Feature Phones for First Time in 2013 – IDC.
[10:44 pm]
Demand for Smartphones to Shift to Emerging Markets
AMD Begins to Send Software Developers Next-Generation APUs.
[7:02 pm]
AMD Starts to Provide Its Next-Gen Fusion APUs to Software Developers
Sony Wants to Become World’s No. 3 Maker of Smartphones.
[11:15 am]
Sony Intends to Become the Third Largest Smartphone Maker in the World
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