News Archive

April, 2013
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News

Tuesday, April 2, 2013


Futuremark Introduces 3DMark for Google Android Devices. Futuremark  3DMark  Android  Google  Microsoft  windows  windows rt  windows 8
[10:58 pm]

3DMark Now Available for Google Android

Samsung Readies Galaxy Mega: Huge Phablets Incoming. Samsung  Galaxy  Galaxy Mega  Exynos  Snapdragon  HTC  Huawei
[10:57 pm]

Samsung Preps New Lineup of Phablets with 5.8", 6.3" Displays

Microsoft Pushes Back Announcement of Xbox Next to May – Expert. Microsoft  xbox  Durango  xbox next  amd  ati  radeon  fusion  jaguar  gcn  sony  playstation  orbis
[10:55 pm]

Microsoft Delays Formal Announcement of Xbox Next “Durango” Game Console, Possibly, to 21st of May

Intel Projects Ultrabooks with Core i “Haswell” Processors, Touch-Screens to Cost $599. Intel  Haswell  Core  22nm  USB  Windows 8  Microsoft
[10:53 pm]

Intel Expects 75% of Intel Powered PCs to Be Touch-Enabled by End of 2013

Toshiba Predicts Emergence of New Energy-Efficient Enterprise Hard Drives. Toshiba  HDD  Business
[10:51 pm]

Toshiba Expects Special HDDs for “Cold” Datacenters

Apple iWatch Due This Year – Component Suppliers. Apple  iWatch  iOS  iPad  iPhone  Samsung  LG Electronics  LG
[10:50 pm]

Apple May Release Its Smart Watch This Year

Nvidia: Next-Generation Mobile Chips to Outperform Current-Generation Video Game Consoles. Microsoft  Xbox  Sony  PlayStation  Nvidia  Tegra
[10:07 pm]

Next-Generation Mobile Devices to Have Raw Computer Power Comparable to PlayStation 3, Xbox 360

GlobalFoundries Demonstrates 3D TSV Capabilities on 20nm Technology. GlobalFoundries  20nm  TSV  Semiconductor
[9:41 pm]

GlobalFoundries Successfully Implements TSVs onto 20nm Manufacturing Process

ARM and TSMC Tape-Out First ARM Cortex-A57 Processor on TSMC's 16nm FinFET Technology. ARM  Cortex  ARMv8  TSMC  16nm  FinFET  Semiconductor
[6:01 pm]

TSMC Produces World’s First ARM Cortex-A57 64-Bit Chip Using 16nm FinFET Technology