Wednesday, November 20, 2013
Microsoft to Become One of World’s Leading Chip Buyers on Nokia Acquisition.
Microsoft Will Gain Importance on Chip Market After Nokia Takeover
Sony PlayStation 4 Costs Less Than $400 to Manufacture, Likely Makes Money
Acer Introduces New Management Structure
Qualcomm Introduces Snapdragon 805 System-on-Chip: Four Cores, New Graphics, Quad-Channel Memory, New Technologies
The World’s First Mass Production of 16nm NAND Flash Initiated by SK Hynix
Tuesday, November 19, 2013
LSI Announces New Nytro XP6200 PCIe Storage Accelerators with 2GB/s Maximum Throughput.
LSI Nytro XP6200 PCIe SSD Accelerator for Read-Intensive Applications
Buffalo Memory Uses Everspin’s STT-MRAM as SSD Cache
Intel Reveals Additional Details About Next-Gen Xeon Phi Co-Processors
Samsung Halts Production of Galaxy Gear as Shipments of Galaxy Smart Watch Fail to Impress
MediaTek Packs Eight ARM Cortex-A7 Cores into MT6592 Application Processor
Qualcomm Toq Set to Become Available Early Next Month
Companies Tap GPU-Enabled Supercomputing to Analyze Enterprise Data on the Fly
Nokia Stockholders Agree to Sell Devices Division to Microsoft
Monday, November 18, 2013
New LSI SandForce Controllers Will Enable SSDs with 1.80GB/s Transfer Speed.
LSI Introduces Third-Generation SandForce SSD Controllers
Sony Sells One Million PS4 Units in First Twenty Four Hours
OpenCL 2.0 Brings A Set of New GPGPU Capabilities
Nvidia Tesla K40 Doubles Memory of Its Predecessor, Enabling New Categories of Accelerated Applications
Automata Processor Addresses Application Domains at the Frontier of High-Performance Computing
AMD Readies New Dual-Chip Flagship Graphics Card
Sunday, November 17, 2013
Acer Goes Back and Into the Future with Intel Celeron “Haswell” Processor-Based PC for $199.
Acer Introduces All-New Google Chome-Based PC with Haswell Processor and $199 Price Tag
Asrock Means Business: Reveals H81 Pro BTC & H61 Pro BTC “Mining Machines”
Friday, November 15, 2013
AMD, Cray, IBM, Intel and Nvidia Receive $25.4 Million in Contracts for Exascale Supercomputer Interconnect Design.
U.S. Department of Energy Awards $25.4 Million in R&D Contracts
AMD Wins CES Innovations Design and Engineering Awards with “Discovery” Tablet Platform
Thursday, November 14, 2013
OCZ Sees Growing Potential for PCIe SSDs, Hints on PCIe Drives with Own Controller.
OCZ Predicts Growing Demand for PCI Express SSDs on PC and Workstation Markets
HP’s Laser Printers Set Up New Milestone
Apple Significantly Increases CapEx Investments to Create Unique Products
Toshiba’s FlashAir Memory Cards Can Now Connect Multiple Devices At Once
Nvidia Simplifies Parallel Programming With Cuda 6 Platform
Microsoft to Help Fighting Internet Crime
Next-Gen Consoles Will Not Support Stereo-3D BD-3D Discs at Launch
AMD Unveils FirePro S10000 12GB Edition GPU Accelerator
Wednesday, November 13, 2013
GlobalFoundries May Land Chip Manufacturing Orders from Apple.
GlobalFoundries and Samsung to Fight Against TSMC Together
Extreme Memory Speeds Reach Notebook PCs
Asetek to Show Off Liquid-Cooled HPC Cluster at SC13
WD Shows Off HDD with Heat Assisted Magnetic Recording Technology
Second-Gen AMD FX “Vishera” Chips to Continue Be AMD’s Highest-End Offering in 2014
Motorola Moto G: Low-Cost Smartphone with Quad-Core Processor
AMD Readies 2W Mullins Chip for Tablets, 10W Beema Chips for 2-in-1s
Gigabyte’s Z87 Mainboard Features Creative Sound Core3D, Killer E2200 Network Card