Bookmark and Share


Intel Corp. is considering to bundle a liquid cooling solution with its next-generation enthusiast-class central processing units (CPUs) code-named Sandy Bridge E (SNB-E). The liquid-based cooler will allow Intel’s Extreme Edition (XE) microprocessors to work at even higher frequencies and thus offer higher performance overall.

For many years Intel has been bundling rather simple cooling solutions with its boxed chips, but recently the company started to offer coolers with heat-pipes for microprocessors in LGA1366 and LGA1156 form-factors. At the Intel Developer Forum in Beijing, China, Intel’s engineers presented a paper called “Overclocking Intel Processor Based Desktop and Mobile Platforms”, where they discussed past, present and future of the company’s support of overclocking as a phenomenon.

Among other things, the document claims that “SNB-E generation considering boxed liquid cooling”. The bundled liquid-based thermal solution – to be offered with boxed microprocessors - will be the first time for Intel to officially support enthusiast-class coolers and will also create an additional selling point of Intel’s next-generation Sandy Bridge E-series microprocessors in LGA2011 form-factor. Besides, bundling liquid cooler with a CPU will indisputably increase popularity of such solutions in generation.

The slide shows Corsair H50 liquid cooler, but Intel may bundle a different solution. The Bright Side of News web-sites notes that there are only two companies who could land a contract of this magnitude: Asetek and CoolIT Systems. Corsair's liquid cooling system is designed and manufactured by Asetek, while CoolIT Systems recently announced cooperation with Corsair on future solutions.

Intel Sandy Bridge E microprocessors due in Q4 2011 are specifically designed for enthusiasts, who demand maximum performance. For example, the chips will carry "extra large cache" to maximize speed of single-threaded or dual-threaded applications, quad-channel memory controller and a number of other enhancements. Sandy Bridge E chips with four or six cores will be paired with code-named Patsburg core-logic set. Platforms based on the latter will feature external base frequency generators  and clock-speeds of buses like SATA or USB locked. As a result, enthusiasts will be able to boost clock-speed of microprocessors using traditional methods by increasing DMI frequencies, something that will allow them to easily and more efficiently to overclock their CPUs.

Thanks to a number of micro-architectural enhancements of Sandy Bridge, the new line of extreme processors promises to be very fast. It remains to be seen whether six-core Intel processors will be able to outperform eight-core chips from Advanced Micro Devices, which are due to be released in Q2 - Q3 2011.

Tags: Intel, Core, Sandy Bridge E, Asetek, Corsair, CoolIt Systems


Comments currently: 1
Discussion started: 04/26/11 07:00:47 AM
Latest comment: 04/26/11 11:29:16 AM


Why not cooler master or antec liquid cooling products? All intel coolers for the last 6 years have been made by cooler master. They both make sealed systems very similar to the corsair product. They might be just labeling oem products made by asetek or coolit though, and not actually producing the products themselves.
1 0 [Posted by: cashkennedy  | Date: 04/26/11 11:29:16 AM]


Add your Comment

Related news

Latest News

Wednesday, November 5, 2014

10:48 pm | LG’s Unique Ultra-Wide Curved 34” Display Finally Hits the Market. LG 34UC97 Available in the U.S. and the U.K.

Wednesday, October 8, 2014

12:52 pm | Lisa Su Appointed as New CEO of Advanced Micro Devices. Rory Read Steps Down, Lisa Su Becomes New CEO of AMD

Thursday, August 28, 2014

4:22 am | AMD Has No Plans to Reconsider Recommended Prices of Radeon R9 Graphics Cards. AMD Will Not Lower Recommended Prices of Radeon R9 Graphics Solutions

Wednesday, August 27, 2014

1:09 pm | Samsung Begins to Produce 2.13GHz 64GB DDR4 Memory Modules. Samsung Uses TSV DRAMs for 64GB DDR4 RDIMMs

Tuesday, August 26, 2014

10:41 am | AMD Quietly Reveals Third Iteration of GCN Architecture with Tonga GPU. AMD Unleashes Radeon R9 285 Graphics Cards, Tonga GPU, GCN 1.2 Architecture