News
 

Bookmark and Share

(0) 

 

Asetek will showcase its range of RackCDU hot water liquid cooling systems for HPC data centers at SC13 including a running 92 node cluster cooled by RackCDU D2C (direct to chip) with monitoring software providing real-time reporting and alerting.

Asetek’s RackCDU range includes RackCDU D2C and RackCDU ISAC (in-server air conditioning). RackCDU D2C provides cooling cost reductions up to 80% and density increases of 2.5x-5x. RackCDU ISAC provides cooling cost reductions exceeding 80% and enables operation without concern for air quality. Operating demonstrations of both technologies will be on display in Asetek’s booth.

“Our successful deployment on NREL’s Skynet cluster in June, recent announcements of other HPC customer installations, and validation of the real-world advantages of Asetek RackDCU D2C by Lawrence Berkeley National Laboratory, make SC13 an ideal venue for attendees to gain an understanding of the benefits of Asetek technology”, said André Sloth Eriksen, founder and chief executive of Asetek.

On display will be D2C liquid cooled servers from Cray including the CS300-LC as well as servers retrofitted with liquid cooling from Cisco, HP, Intel, Super Micro and others. Asetek will also show a prototype of its next generation ISAC RackCDU system. ISAC is a warm water liquid cooling system that makes it possible to operate servers in hostile environments and in data centers without computer room air conditioners (CRAC).

Tags: Asetek, RackCDU

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Wednesday, October 8, 2014

8:52 pm | Lisa Su Appointed as New CEO of Advanced Micro Devices. Rory Read Steps Down, Lisa Su Becomes New CEO of AMD

Thursday, August 28, 2014

12:22 pm | AMD Has No Plans to Reconsider Recommended Prices of Radeon R9 Graphics Cards. AMD Will Not Lower Recommended Prices of Radeon R9 Graphics Solutions

Wednesday, August 27, 2014

9:09 pm | Samsung Begins to Produce 2.13GHz 64GB DDR4 Memory Modules. Samsung Uses TSV DRAMs for 64GB DDR4 RDIMMs

Tuesday, August 26, 2014

6:41 pm | AMD Quietly Reveals Third Iteration of GCN Architecture with Tonga GPU. AMD Unleashes Radeon R9 285 Graphics Cards, Tonga GPU, GCN 1.2 Architecture

Monday, August 25, 2014

6:05 pm | Chinese Inspur to Sell Mission-Critical Servers with AMD Software, Power 8 Processors. IBM to Enter Chinese Big Data Market with the Help from Inspur