by Anton Shilov
09/18/2013 | 11:55 PM
Asetek has announced the first order for its RackCDU data center liquid cooling solution placed by one of its original equipment manufacturing (OEM) partners for an undisclosed end customer. The milestone marks the first instance where an end user has purchased a liquid cooled high performance computing (HPC) cluster through one of Asetek’s OEMs.
This is the first purchase order of RackCDUs for actual installation; although Asetek has sold and delivered several RackCDUs for testing to customers over the past year. The liquid cooling loops will cool and remove all heat from the processors, co-processors, and memory. The loops will ensure the cluster maintains maximum energy efficiency and performance while keeping the operating costs at a minimum. A total of 5 RackCDUs with cooling loops for a total of 280 compute nodes will be purchased for use in the HPC cluster.
Data centers around the globe are being mandated to simultaneously increase energy efficiency, consolidate operations and reduce costs. Each year, data centers consume approximately 30bn watts of electricity, or one percent of global consumption, for cooling alone. Asetek has leveraged its expertise as the world leading provider of efficient liquid cooling systems to create solutions for data centers that address these mandates by providing energy savings, cost savings, density increases, and noise reduction.
“It is rewarding for our investors, employees and customers to see our business model validated in this way. This pivotal step shows that our data center solutions address the pain points of today’s data center operators in a practical and cost effective way,” said André Sloth Eriksen, founder and CEO of Asetek.
RackCDU is a hot water, direct-to-chip, data center liquid cooling system that enables cooling energy savings exceeding 50% and density increases of 250% when compared to modern air-cooled data centers. RackCDU removes heat from CPUs, GPUs, memory modules and other hot spots within servers and takes it all the way out of the data center using liquid.
Free ambient outdoor air cools the water returning to the data center, meaning no power is used to actively chill the water. The water leaving the data center is hot enough to enable waste heat recycling, further increasing energy cost savings, reducing carbon footprint and resulting in cooling energy reuse efficiencies (EREs) below 1.
“In today’s world where power efficiency is of paramount importance it is great to see innovations like Asetek’s RackCDU. This is a highly innovative cooling solution that very much complements our innovative and power efficient Intel Xeon Processor E5 family, new Intel Xeon Phi coprocessors, and Intel Server boards and systems from EPSD. With innovation such as this, essentially all power is being spent on computation rather than on cooling,” stated Noury Al-Khaledy, GM of Intel enterprise platforms and services division.
RackCDU is deployed at a rack/server level providing maximum scalability. The system consists of a zero-U rack level CDU (cooling distribution unit) mounted in a 10” (250mm) rack extension that includes space for 3 additional PDUs, and direct-to-chip cooling loops within each server. The direct-to-chip cooling loops are drop in replacements for the existing air heat sinks, with tubes exiting through an unused PCIe slot. This enables RackCDU deployment as a retrofit during server refresh cycles and in new builds.
“Our RackCDU is brand agnostic, does not require any change in industry standards and will work with any brand of server and rack. We clearly demonstrate this by using off-the shelf hardware throughout the entire cluster. Any data center system integrator, OEM or operator will be able to benefit from our solution and unlike any other liquid cooling solution on the market, our product is based upon our more than 1.3 million liquid cooling units already deployed in the field as well as 13 years of liquid cooling experience,” said Mr. Eriksen.
The full scale showcase will be run live at the show under full load using Caedium’s OpenFoam based CFD software. SC12 will take place in Salt Lake City, Utah on November 12-15, 2012.