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Tuesday, April 30, 2013
Disruption in South Korean Production Could Have Catastrophic Impact on Global Electronics Business.
What Happens If North and South Koreas Collide in a Conflict?
Monday, April 29, 2013
Infineon and GlobalFoundries Team Up for 40nm Embedded Flash Process Technology.
Infineon and GlobalFoundries Jointly Develop 40nm eFlash Process
Thursday, April 25, 2013
AMD and Partners to Discuss the Future of Heterogeneous Computing This November.
AMD and HSA Allies to Show Heterogeneous System Architecture Innovations at APU13 Summit
Apple to Break 230-Days Silence at Opening Keynote at WWDC in June
Tuesday, April 23, 2013
Sales of Apple’s Products Slowdown, But Company Posts Record Second Quarter Revenue.
Apple’s Profit Margins Drop Sharply As Sales of Lower-Cost/Lower Margin Products Accelerate
SES Successfully Transmits 4K Video in HEVC Encoding from Astra Satellite
Apple Criticizes Smartphones with Large Screens, But Does Not Rule Out Large iPhone
Monday, April 22, 2013
Lenovo In Talks to Buy x86 Server Business from IBM – Report.
Lenovo May Acquire Mainstream Business Unit from IBM
Friday, April 19, 2013
Applied Micro and Altera Team Up for Low-Power Custom-Programmable Server Platform.
Altera and AppliedMicro to Cooperate on Joint Solutions for High Growth Data Center Market
ASML Sees Start of 450mm Production in 2018
Thursday, April 18, 2013
Google Chrome OS Is Used by 0.02% of Personal Computers.
After Two Years on the Market, Google Chrome OS Dramatically Behind “Failing” Windows RT
MSI Unleashes 27” AIO System for Gamers
Wednesday, April 17, 2013
Apple’s Policy of Top Secrecy Plays Against the Company These Days – Analyst.
Lack of Product Information Leaks Forces Customers to Believe in Apple’s Rivals
ASML Receives Additional Orders for EUV Equipment
Tuesday, April 16, 2013
Intel: Foundry Business Will Not Have Substantial Revenue Impact for Two to Three Years.
Intel Is Collecting Serious Customers for Its Custom Foundry Division
Microsoft and Foxconn Sign Patent Agreement For Android and Chrome Devices
Microsoft Windows 8.1 “Blue” for Desktops May Feature Traditional Windows Features
Monday, April 15, 2013
TSMC: We Have Not Made a Decision to Build a Fab in the U.S.
TSMC Remains Cautious About Building a Fab in the U.S.
Friday, April 12, 2013
TSMC Pulls 16nm FinFET Risk Production to 2013.
TSMC to Offer Strong Alternative for Competitors
Thursday, April 11, 2013
Researchers Develop One-Layer Thick Germanium Sheet: May Replace Silicon in Semiconductors.
Germanane Set to Compete Against Graphene in the Future Chips
Apple Reportedly Works with TSMC on New Application Processor
Alienware X51 with Ubuntu Linux Could Be the Second Steam Box PC
Tuesday, April 9, 2013
Calxeda Affirms Commitment to HP Project Moonshot and the HP Pathfinder Innovation Ecosystem.
Calxeda Reaffirms Plans to Power HP’s Moonshot Microservers Later This Year
USB 3.0 Gains 10Gb/s Speed, Can Compete Against Thunderbolt
Microsoft Windows XP Still Used by 38% of PCs, Still Has Year Left
Intel Details Rack Scale Server Architecture
Monday, April 8, 2013
Only 27% of Industry Wafer Capacity Dedicated to New-Generation Process Geometries.
Majority of Chips Made Using Outdated Process Technologies
Intel Introduces DSL4510/4410 Thunderbolt Controllers
HP Introduces First Intel Atom-Based Microservers
Friday, April 5, 2013
“Blue” Updates Will Transform Windows 8 into Windows 8.1 – Reports.
Major “Blue” Updates Will Not Mean New Software Names
AMD’s APUs, Radeon HD, FirePro Chips to Offer Breakthrough Performance in Premiere Pro
Thursday, April 4, 2013
TSMC Is Ahead of Its Own 20nm Roadmap – Report .
TSMC Boosts 20nm Output Volume with Accelerated Fab 14 Plans
Wednesday, April 3, 2013
All-Optical Switching Promises Terahertz-Speed Hard Drive and RAM Memory.
Quantum Tricks Drive Magnetic Switching into the Fast Lane
AMD Reiterates Slow Transition to 20nm Node
New Intel NUCs Small Form-Factor PCs in the Works – Report
Intel Reportedly Lands Chip Orders from Cisco
Tuesday, April 2, 2013
GlobalFoundries Demonstrates 3D TSV Capabilities on 20nm Technology.
GlobalFoundries Successfully Implements TSVs onto 20nm Manufacturing Process
TSMC Produces World’s First ARM Cortex-A57 64-Bit Chip Using 16nm FinFET Technology
Sunday, March 31, 2013
Denial of Service of Service Attacks Surge and Expose Enterprise Infrastructure Vulnerabilities – Report.
DDoS Now Leads to Major Financial Losses, Says IDC