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InformationX-bit Labs for mobile users! Do not forget that we are running a special version of X-bit Labs web-site for users of mobile and handheld devices: http://pda.xbitlabs.com. Check out our news and articles from smartphones and PDAs to be always updated on the latest computer and technology news. <%BANNER[left_130x130_2]%>
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CPUIntel Changes Pentium 4 Packaging.Unifies Product Designs?Category: CPU by Anton Shilov [ 10/31/2003 | 01:53 PM ]
Intel Corporation today notified its customers about Intel Pentium 4 CPUs packaging change. The design of the new chip package will resemble the design of the Pentium 4 Extreme Edition processors; analysts believe the move to be aimed on unification of packaging process.
Intel Pentium 4 processors with 512KB L2 cache on 0.13 micron process with 800MHz Quad Pumped Bus will be shipped in two equivalent packages. The following describe the two equivalent packages:
The new packaging for the Pentium 4 processors will have 8 layer substrate compared to 6 layer substrate of the original mPGA478 package, will contain 30 caps/30 pads decoupling on the lower side of the chip versus 12 caps/20 pads decoupling of the original Pentium 4 CPU with 800MHz PSB. In addition, the new chips will sport 3.75mm nominal Z height, up 0.29mm from the initial Z height of the Intel Pentium 4 “Northwood” processor. The new packaging seems to be equal to the packaging of the yet-to-be announced Intel Pentium 4 Extreme Edition processor you can glance at over this article at X-bit labs. The change of the CPU layout was probably done in an attempt to unify the process of producing different CPUs as well as making the mPGA substrates. Related news
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