News
 

Bookmark and Share

(1) 

Intel Corp.’s president and COO Paul Otellini, who will become the company’s CEO in less than two weeks, said during Intel Spring Analyst Meeting that the company would be shipping multi-core processors that have more than two cores in 2007. The executive also revealed some new details about the company’s roadmap, particularly Intel Xeon-family processor code-named Woodcrest.

Intel’s president and COO Paul Otellini said quad-core microprocessors will be available sometimes in 2007. The initial plans include quad-core products for servers, but eventually the technology may be applied to clients as well. Intel’s arch-rival AMD also indicated similar plans for related timeframe.

The company’s president confirmed the development of multi-core processors, particularly Xeon DP chip named Woodcrest, Xeon MP processor called Whitefield, Itanium MP products code-named Tukwila and Poulson in addition to Itanium DP product internally called Dimona.

The executive also indicated that Intel currently has functioning processors code-named Presler, Dempsey and Paxville, which are intended for desktop, 2-way and MP servers respectively. The Presler and Dempsey are produced using 65nm process technology, whereas the Paxville is made using 90nm fabrication process. The claim indicates that Intel is in position to start sales of the mentioned chips in the first half of 2006. Intel will also supply for revenue its dual-core Intel Pentium M processor code-named Yonah as well as Intel Itanium 2 chips named Montecito and Millington in the second half of  2005.

More than one processing engine per central processing units allows CPU to handle more operations at the same time, which is important nowadays, as both client and server computers tend to run multiple software applications at the same time.

According to Intel’s estimations, by the end of 2007 all of the server processors the company will ship at that time will be either dual- or multi-core products, whereas in the performance desktop and performance notebook segments shipments of dual-core chips will account for more than 90%.

Discussion

Comments currently: 1
Discussion started: 09/07/05 01:18:07 AM
Latest comment: 09/07/05 01:18:07 AM

Add your Comment




Related news

Latest News

Friday, May 17, 2013

11:50 pm | Sales of Nintendo Wii U Hit Another Low in the U.S. Nintendo Wii U Just Cannot Become Popular

Thursday, May 16, 2013

11:41 pm | Dell Admits Windows 8 Did Not Meet Expectations, Pins Hopes on “Blue” Updates. Dell Disappointed with Windows 8, But Believes in the Future

10:59 pm | AMD Needs More Than Game Console Design Wins to Offset PC Market Declines – Analysts. AMD Has to Develop Competitive Product Lineup to Survive in Current Environment

10:33 pm | Corning Introduces Corning Lotus XT Glass for High-Performance Displays. Corning Advances Glass Substrate for High-Performance Displays

9:51 pm | True Stereo-3D Will Require 330MP – 3.3GP Resolutions, Says Developer of 8K Video Format. NHK: 8K Is the Final 2D Format, All Future Formats Will Be in 3D

9:41 pm | Innodisk Begins to Ship DDR4 RDIMM Samples to Server Makers. Independent DIMM Supplier Samples DDR4 RDIMMs

8:56 pm | Samsung Develops 45nm Embedded Flash Logic Process Technology. Samsung Successfully Tests 45nm Embedded Flash Logic Manufacturing Tech

7:57 pm | NHK Shows World’s First 8K Movie at Cannes Film Festival. Japanese National Broadcasting Company Demos 8K Movie, Content to Film Industry

7:27 pm | Intel’s Paul Otellini: Lack of Chip for iPhone, iPad Was My Worst Mistake. Intel’s Outgoing CEO Regrets About Mission Opportunities with Apple iOS