News
 

Bookmark and Share

(11) 

The world’s second largest maker of x86 microprocessors, Advanced Micro Devices, disclosed plans to introduce enhanced multi-core processors that support built-in DDR3 memory controller as well as to present platform initiatives that allow more than 8 physical chips to be installed into a single system. 

By 2008 AMD is set to introduce its so-called Direct Connect architecture 2.0 that would improve interconnection between processors and processing engines within a chip. The new interconnection architecture will allow more than 8 processors to be connected in a single coherent memory system without the need for additional logic devices. The company plans to offer the architecture that will allow to easily build up to 32-way systems.

In addition, AMD, along with its infrastructure partners, plans to incorporate and
support DDR3 memory technology. The first samples of such products are set to emerge in 2007, whereas the first DDR3-supporting products for consumers, such as AMD Athlon 64 and Sempron processors, will be available in 2008, according to the current plans of AMD.

Earlier it was reported that AMD plans to commercially launch quad-core chips, Hyper-Transport 3.0 interconnection protocol, extend AMD64 instruction set, as well as add FB-DIMM support for server processors in 2007.

Among the short-term plans of AMD the company names such features dual-channel DDR2 memory support, virtualization and security capabilities in addition to advanced thermal management and advanced power management features. Chips with such functionality are expected to emerge in 2006.

Discussion

Comments currently: 11
Discussion started: 11/29/05 02:09:40 PM
Latest comment: 08/25/06 01:15:30 PM

Add your Comment




Related news

Latest News

Wednesday, October 8, 2014

8:52 pm | Lisa Su Appointed as New CEO of Advanced Micro Devices. Rory Read Steps Down, Lisa Su Becomes New CEO of AMD

Thursday, August 28, 2014

12:22 pm | AMD Has No Plans to Reconsider Recommended Prices of Radeon R9 Graphics Cards. AMD Will Not Lower Recommended Prices of Radeon R9 Graphics Solutions

Wednesday, August 27, 2014

9:09 pm | Samsung Begins to Produce 2.13GHz 64GB DDR4 Memory Modules. Samsung Uses TSV DRAMs for 64GB DDR4 RDIMMs

Tuesday, August 26, 2014

6:41 pm | AMD Quietly Reveals Third Iteration of GCN Architecture with Tonga GPU. AMD Unleashes Radeon R9 285 Graphics Cards, Tonga GPU, GCN 1.2 Architecture

Monday, August 25, 2014

6:05 pm | Chinese Inspur to Sell Mission-Critical Servers with AMD Software, Power 8 Processors. IBM to Enter Chinese Big Data Market with the Help from Inspur