News

Intel Corp. is expected to introduce its updated platforms for high-end servers and workstations late this month, according to some sources with knowledge of the plans. Initially the new platforms code-named Bensley and Glidewell will work with the NetBurst-based microprocessors, but in the second half of the year they will enable next-generation micro-architecture based chips code-named Woodcrest.

The world’s largest chipmaker is expected to introduce its Intel Xeon processors code-named Dempsey, which feature similar design to the desktop Presler (Intel Pentium D 900) chips, intended for dual-processor configurations. The new Xeon processors will feature 4MB L2 cache (2MB cache per core), 667MHz or 1066MHz processor system bus and will operate at clock-speeds in the range of 2.80GHz – 3.73GHz, according to some sources. The Dempsey chips will be Intel’s first server/workstation processors featuring LGA771 form-factor.

The new Bensley platform will be based on Intel 5000P (Blackford) and Intel 5000V (Blackford VS) chipsets that support dual-core processors, PC2-4300 FB-DIMM memory, PCI Express bus, Intel’s hyper-threading, virtualization, active management and I/O acceleration technologies. The Intel 5000P is positioned to support chips that have 667MHz or 1066MHz processor system bus, whereas the Intel 5000V is positioned to work with processors that feature 667MHz bus.

The Glidewell platform features the Intel 5000X (Greencreek) chipset that, in addition to the capabilities mentioned ahead, brings support for PCI Express x16 bus required for graphics cards.

Later during the year the Bensley and Glidewell platforms will be able to support code-named Woodcrest processors with 1333MHz processor system bus.

Intel did not comment on the news-story.

Discussion

Comments currently: 0

You must log in to add comments.

Forgot password? Registration

remember me



Related news

Latest News

Friday, July 3, 2009

5:50 pm | Apple Reminds: iPhone and iPod Overheat at 35 Degrees Celcius. Apple Issues Warning Concerning Overheating

1:09 pm | Former Intel’s Chief Does Not Expect Quick Results from Intel-Nokia Pact. Feasibility of Intel’s and Nokia’s Partnership to Be Clear in Several Years

9:15 am | Nvidia's Chief Executive Publicly Unveils Pricing of "Ion" Core-Logic. Nvidia’s Ion Platform Appears to Be Up to Three Times More Expensive than Intel’s

Thursday, July 2, 2009

11:42 pm | Transcend Equips Memory Modules with Thermal Sensors. Transcend's New Memory Modules Can Monitor Their Temperature

10:17 pm | AMD Will Not Support Nvidia's CUDA Technology. AMD Not Interested in Supporting Nvidia's CUDA

3:46 pm | Sony Claims that UMD-Less PlayStation Portable Was Always In The Plans. Sony's Claims Raises Question Whether UMD Ever Was a Compulsory Element of PSP

12:43 pm | DDR3 to Capture 30% of the Market by Year End - DRAMeXchange. Contract DDR3 Prices to Increase in July