News

Intel Corp. the world’s largest maker of x86 microprocessors, reportedly plans to introduce a chip for low-cost systems with integrated memory controller and built-in input/output (I/O) functionality. The introduction of such processor may redefine the market of very affordable systems and may pose some threat to companies like Via Technologies.

Slides, which are presumably from Intel roadmap, indicate that Intel Tolapai system-on-a-chip (SoC) will include a Pentium M-like microprocessor with 256KB L2 cache, integrated dual-channel DDR2 memory controller that supports PC2-3200 (400MHz), PC2-4200 (533MHz), PC2-5300 (667MHz) and PC2-6400 (800MHz) memory modules, PCI Express controller as well as I/O bridge that features support for Serial ATA, USB, Gigabit Ethernet and so on.

The x86 processing engine on the chip will operate at 600MHz, 1.06GHz or 1.2GHz clock-speeds and its thermal design power varies from 13W to 25W.

The new processor, according to HKEPC web-site, will come in 1088-ball flip-chip ball grid array (FCBGA) form-factor and will be mainly aimed at embedded, small form-factor and low cost systems. For example, it is possible to assemble a very low-cost computer based on the Tolapai processor and accompanied by a graphics adapter, a hard disk drive, an optical drive and a monitor, which may be an interesting option for developing countries.

Currently Advanced Micro Devices and Via Technologies offer their Geode and C7 families of products to emerging markets and another rival targeting the same market segment with its offering will indisputably redefine the market of low-cost PCs. Intel once attempted to enter a highly-integrated platform code-named Timna, but cancelled the plan in the late nineties.

In addition to targeting emerging markets, Tolapai may also be the first highly-integrated chip of its kind with roadmap extending to central processing units with integrated graphics capabilities.

Tolapai client’s reference board is set to be available in Q2 2006 and the final product is projected to ship in late 2007.

Discussion

Comments currently: 5
Discussion started: 02/05/07 05:52:11 AM
Latest comment: 02/06/07 03:15:23 AM
Expand all threads | Collapse all threads

[1-3]

1. 
About time! Kick VIA in the ***!!! Yeah! \o/
I hope AMD follows! Geode is almost non-existant, I haven't seen a single Geode in any store (on the web or an actual store) here in Sweden.
[Posted by: Random visitor  | Date: 02/05/07 05:52:11 AM]

2. 
"Tolapai client’s reference board is set to be available in Q2 2006 and the final product is projected to ship in late 2007."

I bet, that the executive said: "i want it ready yesterday".
it wouldn't be too hard to add a cpu to northbridge i guess.
[Posted by: robotic  | Date: 02/05/07 08:33:23 AM]
+ expand thread (2 answers)

3. 
Pentium III Celeron chip, code-named Timna

Originally, Timna was scheduled to be released in the second half of 2000, but due to its built in RDRAM interface and problems with the MTH (Memory Translator Hub), it has been delayed until Q1 2001.

This chip was discontinued by Intel on September 29, 2000.
[Posted by: Tom  | Date: 02/05/07 03:04:14 PM]

[1-3]

You must log in to add comments.

Forgot password? Registration

remember me



Related news

Latest News

Saturday, November 7, 2009

3:28 pm | Electronic Book Industry Set to Explode in 2010 – Analysts. E-Book Industry Set to Raise – MIC

1:31 pm | Intel Plans “Fast” Transition to Next-Generation Atom Platform. Intel to Reveal More Details About Pine Trail Platform on December 21

11:27 am | Prices of SSDs Will Get Closer to Hard Drives in Three to Five Years – Chief Executive of OCZ. SSDs Set to Become Much More Affordable in the Future

Friday, November 6, 2009

11:56 am | Microsoft Windows 7 Appears to Be More Popular in Retail than Vista Back in 2007. First Week Windows 7 Sales Surpass Sales of Windows Vista in First Week – Research Firm

9:30 am | Elpida and ProMOS Sign “Technology-for-Capacity” Pact. Elpida to Outsource Production of DRAM to ProMOS