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CPU

AMD Expands Embedded Lineup with AMD Sempron Chip.

AMD Unveils Sempron Chip with 9W Thermal Envelope

Category: CPU

by Anton Shilov

[ 05/31/2007 | 08:52 PM ]

Advanced Micro Devices expanded on Thursday its lineup of microprocessors for embedded systems with AMD Sempron as well as AMD Geode LX chips. The new processors will enable higher performance for embedded devices as the Sempron chips features x86-64 capability.

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“By expanding our product portfolio with this new, very low power version of the highly successful AMD Sempron processor and extending the temperature support in our Geode line, AMD is delivering on our promise of customer-centric innovation for a range of embedded markets,” said Greg White, vice president of embedded computing solutions division at AMD.

The new – and the most powerful AMD’s offering for embedded systems – Sempron processor 2100+ has thermal design power of only 9W, which is pretty low. Still, the novelty should have relatively high performance and support for 64-bit execution, which may turn into a benefit eventually. The novelty is compatible with AMD’s M690T core-logic and may come in socket S1 form-factor.

Besides, AMD also introduced AMD Geode LX 700@0.8W, AMD Geode LX800@0.9W and AMD Geode LX 900@1.5W processors. The Geode LX800@0.9W

can operate 40 to +85 degrees Celsius range, which may be useful for extreme computing environments: telecommunications infrastructure (including wired, wireless and MSB/MSC), single board computing, automotive and transportation systems, and industrial control and monitoring.

A host of embedded board manufacturers have products available that will accommodate the extended temperature AMD Geode LX processor, including Advantech, Aaeon, Arbor, ICP, and IBase, while both Aaeon and Arbor offer boards that will accommodate the new AMD Sempron processor Model 2100+.

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