Bookmark and Share

Tags

32nm 40nm 45nm AMD Apple ASUS ATI ATIC Atom Business Cypress E-Book Evergreen Fermi Flash Geforce Globalfoundries GT300 Intel Microsoft Nforce Nokia Nvidia Radeon Semiconductor Sony SSD TSMC USB Windows

News

Advanced Micro Devices reportedly plan to compete for the place on the market of ultra low-cost personal computers (ULCPCs) using a previous-generation AMD Sempron-like processor. The new chip is projected to emerge already late this year and the chipmaker is reportedly already negotiating with system makers.

According to news-stories published by Eee PC News and DigiTimes web-sites, the new AMD processor for ULCPCs will sport 64-bit K8 micro-architecture-based processing core, 64KB L1 instruction cache, 64KB L1 data cache, 256KB L2 cache as well as single-channel DDR2 memory controller. The central processing unit is projected to operate at 1.0GHz and sport thermal design power of 8W while being made using 65nm process technology. AMD plans to ship the product in ball grid array packaging, which is ideal for low-cost, low-power, small form-factor systems.

The new chip resembles currently existing AMD Sempron processor in many ways, though, pricing of the product is projected to be lower than that of Intel Atom processors for the same market segments. Since AMD64/K8 micro-architecture is generally more advanced than that of Intel Atom or Via Nano, AMD’s chip may offer considerably higher performance than its rivals.

Advanced Micro Devices did not comment on the potential AMD Sempron-derivative for ULCPCs market, however, the company is well-known for its 50x15 program of promotion low-cost systems for emerging markets as well as for some other initiatives, including Personal Internet Communicator, OLPC XO laptop based on AMD Geode and some other projects.

The world’s second largest maker of x86 microprocessors had reportedly already started to negotiate about supplies of new chips with Acer, HP, MicroStar International (MSI) and some vendors in China.

Discussion

Comments currently: 2
Discussion started: 06/24/08 08:48:53 AM
Latest comment: 06/24/08 09:22:54 AM
Expand all threads | Collapse all threads

[1-1]

1. 
"AMD plans to ship the product in ball grid array packaging, which is ideal for low-cost, low-power, small form-factor systems."

what's ball grid array packaging?
[Posted by: whickywhickyjim  | Date: 06/24/08 08:48:53 AM]
+ expand thread (1 answer)

[1-1]

You must log in to add comments.

Forgot password? Registration

remember me



Related news

Latest News

Tuesday, November 24, 2009

4:04 pm | Imagination Intros Processors for “Internet Everywhere” Consumer Electronics. Imagination Presents Connected Processors for CE Devices

3:33 pm | Sub-$99 Blu-Ray Players Black Friday Deals Available, But Not a Lot. Walmart to Sell BD Players for $78 on Black Friday

12:27 pm | Microsoft Sued for Banning Third-Party Xbox Memory Cards. Memory Cards Supplier Sues Microsoft

11:55 am | OCZ to Release External USB 3.0 Solid-State Drive. OCZ USB 3.0 SSD Incoming for Consumer Electronics Show

7:52 am | Nvidia’s CEO Expects Underpowered Mobile Devices to Gain Popularity. PC of the Future – Web-Based Device with 4G Connectivity, Says Chief Exec of Nvidia