Intel’s 35W Chips to Feature FC-PGA Packaging
[11/24/2008 01:14 PM]Despite of expectations, Intel Corp.’s microprocessors for desktops with dramatically reduced power consumption will feature form-factor developed for mobile computers. Therefore, the new chips will require mainboards featuring appropriate sockets.
Last week it was reported that the first breed of 35W chips for high-performance desktops made using 45nm process technology will be released already this month, whereas additional chips will be added into family on the 28th of December. The family of ultra low-power chips for desktop computers will include both dual-core and quad-core central processing units, which are projected to be compatible with desktop mainboards featuring mobile sockets infrastructure.
“The T-and P-series CPUs are not LGA775 compatible, they are mobile sockets,” an Intel spokesperson said.
As a result, system integrators or end-users looking forward high-performance dual-core or quad-core central processing units (CPUs) with 35W thermal envelope will have to use FCPGA6 infrastructure for desktops, which automatically increases pricing of such solutions.
| Date: 11/24/08 03:08:54 PM]
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