Advanced Micro Devices will offer dual-core microprocessors for thin-and-light notebooks in 2009, the company revealed on Wednesday. While there is no news that AMD is preparing dual-core chips for ultra-portable notebooks, the company’s confirmation that those products will be available already this year sounds promising.
According to AMD’s spokesman John Taylor, the company is on track to release its code-named Congo platform in 2009. Apart from dual-core AMD Athlon Neo central processing unit, the new platform aimed at ultra-portable mobile computers will deliver better multimedia capabilities as well as other improvements over the code-named Yukon platform for thin-and-light notebooks.
AMD’s Congo platform is based on dual-core code-named Conesus central processing unit as well as AMD RS780M + SB710 core-logic set that features ATI Radeon HD DirectX 10-class graphics core as well as ATI Avivo HD hardware high-definition video post-processing engine.
The first microprocessors to power cheap ultra-think notebooks from AMD are Athlon Neo MV-40 (1.60GHz, 512KB level-two cache) with 15W thermal design power (TDP), AMD Sempron 210U (1.50GHz, 256KB L2 cache) with 15W thermal envelope and AMD Sempron 200U (1.0GHz, 256KB L2 cache) with 8W TDP. All chips are made using 65nm process technology.
According to AMD, power-consumption of the new dual-core chips will not exceed that of single-core AMD Athlon Neo products.
AMD did not announce when code-named Congo platform hits the market in 2009.