Advanced Micro Devices has unveiled two new AMD Sempron processors for embedded systems that feature new packaging technology as well as lower power consumption. According to AMD, the new lidless packaging will allow to make AMD-based systems smaller and more attractive to various customers.
“These new lidless BGA packaged processors can help customers significantly shrink their embedded design into new smaller, flatter form factors without having to sacrifice any computing performance. Retail touch screens, self-service kiosks and digital signage are a growing part of the consumer experience and thin client computing continues to play a strong role in helping businesses become more efficient. These new processor features will help our customers stay on the cutting edge of embedded system design,” said Buddy Broeker, director of embedded product marketing at AMD.
Customers can further streamline development by pairing the new AMD Sempron 210U and 200U processors with single-channel DDR2 memory controller with the AMD M690E chipset. This embedded platform can help speed time to market and deliver the graphics and display options that are increasingly important in embedded systems. It is likely that later this year AMD will deliver dual-core embedded processors in lidless BGA packaging, enabling high-performance on very small systems.
Embedded systems based on the AMD Sempron 210U and 200U processors are also available from iBASE, aValue, EVOC, Gigabyte, and Inventec while additional AMD embedded customers are expected to bring systems to market in 2009.
“The new AMD Sempron 210U processors enable us to deliver high performance in a very low power thermal range, and with the BGA package, we are able to offer increasingly compact designs,” said Curt Schwebke, chief technology officer for Wyse Technology.