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Advanced Micro Devices has reaffirmed plans to start production of its code-named Llano microprocessors in the first half of next year. While the sign seems to be generally good, given track-record of Llano and surrounding rumours, it is hard to make projections.

"Production shipments of Llano, our 32nm APU, are planned to occur in the first half of next year," said Dirk Meyer, chief executive officer of AMD, during his recent conference call with financial analysts.

Up to the middle of 2010 the Sunnyvale, California-based chip designer convinced the world that it would ship to customers code-named Llano chips with high performance x86 cores and advanced DirectX 11 graphics in late 2010. But then the company said that the 32nm SOI process technology - jointly developed by AMD, Globalfoundries, IBM, - had been too immature to produce commercial yields. Due to low yields, AMD had to delay the roll-out of code-named Llano product, as some reported, until the second half of the year 2011. Meanwhile, AMD's claim causes some optimism.

In general, the company hopes that accelerated processing units with both x86 and graphics stream processors inside them would provide it a major source for further growth.

"We expect the APUs to provide an opportunity for us to get more platform design wins and get a greater percentage of sell-outs based on the differentiated value proposition, which comes really in two forms. Number one, superior graphics performance at better price points and better power points than is available from the competition," said Mr. Meyer.

Quite a lot is known about Llano processor, which is a part of Sabine platform. As reported earlier, AMD Llano accelerated processing unit (APU) will have four x86 cores based on the current micro-architecture each of which will have 9.69mm² die size (without L2 cache), a little more than 35 million transistors (without L2 cache), 2.5W – 25W power consumption, 0.8V – 1.3V voltage and target clock-speeds at over 3.0GHz clock-speed. The cores will dynamically scale their clock-speeds and voltages within the designated thermal design power in order to boost performance when a program does not require all four processing engines or trim power consumption when there is no demand for resources. According to sources familiar with the matter, different versions of Llano processor will have thermal design power varying from 20W to 59W: high-end dual-core, triple-core and quad-core chips will have TDP between 35W and 59W; mainstream chips with two of four x86 cores will fit into 30W thermal envelope and low-power dual-core Llano chips will have 20W TDP. Llano will be made using 32nm SOI process technology.

AMD Sabine platform will also include code-named Hudson input/output controllers that will support PCI Express graphics port, 16 USB ports, USB 3.0 support (Hudson M3 only), 6 Serial ATA ports with RAID support, 1Gb Ethernet, integrated video DAC, integrated clock-generator and so on. Besides, Sabine may also feature optional Vancouver-series graphics processing units.

Tags: AMD, Fusion, Llano, 32nm, Phenom, Evergreen, Radeon

Discussion

Comments currently: 7
Discussion started: 10/15/10 02:04:16 AM
Latest comment: 10/19/10 02:52:06 PM
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1. 
Llano first then Bulldozer. Q2/Q3, whats the problem with that? In 2011 AMD will deliver 3 new designs, 2 new architectures, tens of platforms covering an extreme range of computing, from embedded eOntario to nettops to netbooks to laptops to multicore clients to 16 core server chips. You should be thrilled instead of whining like little girls.
0 0 [Posted by: bereft  | Date: 10/15/10 02:04:16 AM]
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2. 
H1 2011 "production" doesn't mean retail availability. Intel has just announced that Sandy Bridge has been put in commercial production for early 2011 availability.

So H1 2011 in reality means Q2 2011, which means that Llano availability should be expected for Q3 2011.

... And those who are not interested in integrated graphics and want a truly next-gen CPU are still waiting for a firm announcement from AMD regarding Bulldozer production and availability.

0 0 [Posted by: BernardP  | Date: 10/15/10 07:10:10 AM]
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3. 
Anyway, investing in an AMD platform has always proven a better deal than in Intel's. On AMD now you can have USB3 native SATA3 and go rom 1CORE to 6CORE. On INTEL you don't have anything like this . And there is also the price. AMD is 3 times less expensive.
0 0 [Posted by: East17  | Date: 10/15/10 05:11:04 PM]
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4. 
Dont forget the ECC memory support on client/desktop motherboards and cpus also. Try that on Intel but before you do that, have in handy a bottle of vaseline, you'll need it.
0 0 [Posted by: bereft  | Date: 10/15/10 05:53:59 PM]
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5. 
1. dirk has confirmed llano shipments 1H-2011
2. charlie's sources agree. release+ramp q2-2011.
3. ms. sobon's statement of summer 2011 (june/july/august) but only june is 1H-2011.
but im betting april llano cpu availability, because summer in austin, texas comes earlier than everywhere else.
and she hinted PRODUCT AVAILABILITY in june(by product i read systems). im just being conservative calling june as llano-launch.

Q3 BD release isnt bad news at all.

BD is a new uarch, on a new node- and yet only ~4Q from tape-out to release!
tapeout is 2Q-2010, release is likely 3Q-2011.
and that doesnt even consider the other scenario where
llano releases Q2-2011(april) and BD follows Q2-2011(may or june)!
[hint: am3+ mobos release Q2-2011.]

there's not a rule w/c doesn't allow that, right?


at any rate, intel doesnt have any viable answer to llano, at all.
the delta in performance between amd gpu/intel gpu is a lot more in favor of amd
compared to the performance delta between amd cpu/intel cpu.

and theres not even a comparable intel gpu on any intel roadmaps to 2015 at least.
so thats what, 16 quarters of pounding intel to the ground on total platform performance.

have i even mentioned ontario?
i bet mr. otellini will be so much more on the phone again bribing OEM's.
0 0 [Posted by: wuttz  | Date: 10/16/10 08:46:36 PM]
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- collapse thread

 
"BD follows Q2-2011(may or june)!
[hint: am3+ mobos release Q2-2011.]"

So this is confirmed by AMD? Article says no. And does the Q2-2011 release of AM3+ mobos indicate the release time frame for BD CPU's? Why would they release AM3+ mobos but make the users stick with AM3 CPU's?
0 0 [Posted by: dizzystuff  | Date: 10/17/10 02:51:09 PM]
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6. 
vows?!

this news is boring! wake me up when they start shipping the real chips! with their track record, don't be surprised if they arrive by 4th quarter next year!
0 0 [Posted by: dudde  | Date: 10/19/10 02:52:06 PM]
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