News
 

Bookmark and Share

(0) 

LSI Corp. said this week that the company collaborated with Fujitsu to design the new multi-core SPARC64TM IXfx processor for highly scalable supercomputing applications. The new chip, which features a significant performance boost over the previous generation, couples Fujitsu’s multi-generational expertise in high-performance computing and LSI’s industry-leading custom silicon tech.

The SPARC64 IXfx processor is manufactured using 40nm process technology, has 16 high-performance cores, 64KB I/D cache and 12MB shared L2 cache memory to handle the data rate requirements of supercomputing applications. The chip works at 1.848GHz and provides 236.5GFLOPS of double-precision performance while consuming 110W of power. LSI’s custom silicon capability allows storage and networking customers the ability to offer highly differentiated hardware solutions to meet customer demands.

 
Fujitsu SPARC64 IXfx block diagram and specs. Image by Ccidnet.com

“The SPARC64 IXfx delivers the speed and flexibility our supercomputing application customers are looking for. The combined expertise of LSI and Fujitsu utilized in the development of the SPARC64 IXfx provides customers with increased performance and allows them to run essential applications more effectively,” said Akira Asato, general manager of LSI development division of next generation technical computing unit at Fujitsu.

LSI’s deep expertise and heritage in custom silicon significantly improved the SPARC64 IXfx time to market while meeting aggressive performance targets, according to the company.

“To meet their requirements, Fujitsu desired a partner with deep expertise in highly complex SoCs and the know-how to meet aggressive schedules and performance targets. Collaborating with Fujitsu on the SPARC64 IXfx processor underscores our commitment to working with customers to deliver time-to-market solutions for mission-critical deployments,” said Sudhakar Sabada, senior vice president and general manager of custom solutions division at LSI.

Tags: Fujitsu, LSI, Sparc, 40nm, TSMC, Sun Microsystems

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Friday, May 17, 2013

11:57 pm | 4K Ultra-High Definition TVs Set to Become New Standard – Report. 4K Ultra-High Definition TVs Set to Become New Standard – Report

11:50 pm | Sales of Nintendo Wii U Hit Another Low in the U.S. Nintendo Wii U Just Cannot Become Popular

Thursday, May 16, 2013

11:41 pm | Dell Admits Windows 8 Did Not Meet Expectations, Pins Hopes on “Blue” Updates. Dell Disappointed with Windows 8, But Believes in the Future

10:59 pm | AMD Needs More Than Game Console Design Wins to Offset PC Market Declines – Analysts. AMD Has to Develop Competitive Product Lineup to Survive in Current Environment

10:33 pm | Corning Introduces Corning Lotus XT Glass for High-Performance Displays. Corning Advances Glass Substrate for High-Performance Displays

9:51 pm | True Stereo-3D Will Require 330MP – 3.3GP Resolutions, Says Developer of 8K Video Format. NHK: 8K Is the Final 2D Format, All Future Formats Will Be in 3D

9:41 pm | Innodisk Begins to Ship DDR4 RDIMM Samples to Server Makers. Independent DIMM Supplier Samples DDR4 RDIMMs

8:56 pm | Samsung Develops 45nm Embedded Flash Logic Process Technology. Samsung Successfully Tests 45nm Embedded Flash Logic Manufacturing Tech

7:57 pm | NHK Shows World’s First 8K Movie at Cannes Film Festival. Japanese National Broadcasting Company Demos 8K Movie, Content to Film Industry

7:27 pm | Intel’s Paul Otellini: Lack of Chip for iPhone, iPad Was My Worst Mistake. Intel’s Outgoing CEO Regrets About Mission Opportunities with Apple iOS