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While the next-generation high-end desktop (HEDT) family of chips is several quarters away, the first pictures of the Intel Core i7 Extreme “Haswell-E” central processing unit has already been published. This confirms that the new products have already reached Intel’s partners who are about to start testing the new chips and design their PCs for the second half of next year.

The engineering sample of what is claimed to be code-named Haswell-E processor does not look like an extraordinary chip. It features eight cores, runs at 3.0GHz and was assembled in the U.S. Most likely, it features eight x86 cores, reports VR-Zone web-site. Besides, it has a new heat-spreader that covers parts of the processor’s substrate as well. It is unclear whether this was made to make the chip more suitable for advanced cooling system, or certain components on the substrate needs additional cooling.

The next year’s enthusiast desktop platform will pack a number of firsts and will naturally bring a significant performance boost over regular desktop platforms as well as over existing and incoming HEDT solutions based on code-named Ivy Bridge-E processor. Intel Core i7 “Haswell-E” central processing units will pack six or eight x86 cores with Haswell micro-architecture and Hyper-Threading technology, 20MB of L3 cache, quad-channel DDR4 memory controller (2133MHz maximum clock-speed, up to one DIMM per channel) as well as Turbo Boost 2 technology. The processors will traditionally have 40 integrated PCI Express 3.0 lanes, but will lack built-in graphics adapter, which is logical.

The forthcoming enthusiast-class desktop platform will rely on code-named Wellsburg chipset and will use all-new LGA2011-3 socket. Interestingly, the new microprocessors will have up to 140W thermal design power, which points to high clock-rate in addition to high core-count. Besides, traditionally Intel will unlock all multipliers on HEDT platform to allow maximum level of customization.

Based on Intel’s expectations, the new eight-core Core i7 “Haswell-E” will bring 55% performance improvement over quad-core Core i7 “Haswell” processor clocked at 3.70GHz. When both frequency increases as well as increased core-count are taken into account, the Haswell-E should be over 30% faster compared to Ivy Bridge-E.

Intel did not comment on the news-story.

Tags: Intel, Haswell-E, Haswell, Ivy Bridge-E, HEDT, 22nm, Core

Discussion

Comments currently: 5
Discussion started: 12/14/13 09:16:34 PM
Latest comment: 12/18/13 12:20:53 AM
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1. 
It will make Windows XP run faster. But this is the old paradigm.
1 3 [Posted by: linuxlowdown  | Date: 12/14/13 09:16:34 PM]
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Windows XP doesn't support AVX
0 0 [Posted by: basroil  | Date: 12/15/13 08:08:12 AM]
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2. 
You're going to have to pay to play if you want the fastest CPU in town. Fortunately for most, significantly less expensive processors can still get you 95% of the performance.
0 0 [Posted by: UnbiasedONE  | Date: 12/16/13 08:58:35 AM]
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3. 
I understand this chip will be really complex but such a shame Intel couldn't make it on the new 14nm process as i can see heat being a massive issue for this chip.
0 0 [Posted by: loadwick  | Date: 12/17/13 03:59:32 PM]
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With each process node shrink, the circuits become smaller, and yes they use less power, and produce less heat, but these smaller circuits are packed closer together and the power savings/heat produced does not scale at the same rate as the circuit count per unit area! these densely packed circuts can actually result in more heat per unit area produced, than the available(less atoms with each process node shrink) substrate atoms to carry away the thermal load, resulting in a hotter running chip. These thermal budget scaling issues were present with the process node shrink from 32nm to 22 nm, and they will be even more pronounced going from 22nm to 14nm, as there needs to be enough atoms surrounding these circuits to absorbe and transfer the heat, this can, and is interfering, with the 14nm process node development/engineering, and may result in the smaller 14nm size circuits having to be spaced farther apart, to maintain some form of thermal equilibrium, and thereby, resulting in less die area space savings, compared to the earlier 32nm and 22nm process node shrinks.
1 0 [Posted by: BigChiefRunAmok  | Date: 12/18/13 12:20:53 AM]
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