by Anton Shilov
08/03/2011 | 07:04 PM
After many years of relying on silicon-on-insulator (SOI) process technology, Advanced Micro Devices plans to start using bulk process technology for its state-of-the-art Opteron processors code-named Dublin and Macau in 2013, according to a slide that resembles those from AMD's roadmaps.
AMD's forthcoming Bulldozer micro-architecture based Opteron "Interlagos" and "Valencia" microprocessors are set to be made using 32nm silicon-on-insulator process technology at Globalfoundries. The code-named Terramar and Sepang chips, which will feature enhanced Bulldozer micro-architecture (also known as Piledriver) and will have up to 20 and 10 cores, respectively, will also be made using the same manufacturing technology in 2012. But the central processing units (CPUs) for servers that will succeed them in 2013 - Dublin and Macau - will be made using 28nm fabrication process with high-k metal gate, according to a slide published by CPU World web-site that resembles those from AMD's documents.
Terramar and Dublin will use the same G2012 server platform code-named Porto, whereas Sepang and Macau will utilize C2012 server platform known under Luxembourg code-name. AMD G2012 infrastructure will support quad-channel DDR3 memory as well as PCI Express 3.0 controller. The C2012 infrastructure will sport triple-channel memory controller and will also support PCIe 3.0.
It is noteworthy that Dublin and Macau are currently not supposed to increase core count to over 10 for one die or 20 for one MCM module. Potentially, this means that the next-generation Bulldozer micro-architecture will sport a significant amount of enhancements that will allow the new chips to tangibly increase performance without boosting the number of x86 cores. According to AMD's longer-term sketch roadmap, the Opteron processors in 2013 will not start to integrate stream processors to accelerate certain tasks.
Given the fact that at present both Dublin and Macau are in development, AMD can easily change its opinion regarding any technical specifications or design decisions.
AMD did not comment on the news-story.