AMD Unveils 2014 Ultra-Mobile Roadmap: Beema and Mullins SoCs Confirmed

AMD Readies 2W Mullins Chip for Tablets, 10W Beema Chips for 2-in-1s

by Anton Shilov
11/13/2013 | 10:26 PM

At the APU13 Developer Conference today Advanced Micro Devices its 2014 mobile accelerated processing unit (APU) product roadmap. The new code-named Beema and Mullins system-on-chips with 10W and 2W thermal design power, respectively, will address various devices, such as 2-in-1s and ultrathin notebooks as well as tablets.

 

Both new system-on-chip families – Beema and Mullins – offer two or four “Puma” x86 cores, AMD Radeon graphics engine and are made using a 28nm system-on-chip process technology. The latest AMD APUs also support Microsoft InstantGo for faster wake times and to ensure data such as email actively refresh in standby. Both new processor families are also the first to integrate an AMD-developed platform security processor based on the ARM Cortex-A5 featuring ARM TrustZone technology for enhanced data security.

The new low-power APUs join the previously disclosed high-performance notebook APU, codenamed “Kaveri”, in AMD’s 2014 mobile lineup. The new processors are planned to launch in the first half of next year and will be demonstrated at CES 2014 as part of a full suite of AMD products.

“AMD is establishing excellent momentum this year in the low-power, mobile computing market and with ‘Mullins’ and ‘Beema’ coming in 2014 we are not standing still. AMD aims to deliver a set of platforms in the first half of next year that will outperform the competition in graphics and total compute performance in fanless tablets, 2-in-1s and ultrathin notebooks,” said Mark Papermaster, AMD’s chief technology officer and senior vice president, during his closing keynote at APU13.