News
 

Bookmark and Share

(0) 

Nvidia Corp. has reportedly updated chip packaging of its GeForce 8-series graphics cards in order to improve reliability and availability, according to documents seen by the media. Since graphics cards belong to the lineup of desktop solutions, Nvidia might have experienced abnormal failure rates, which will cause the company to take another charge that could be hundreds of millions big.

Apparently, Nvidia has changed packaging material for G86-303-A2, G86-103-A2 as well as G86-213-A2, which power low-end desktop GeForce 8400-series graphics cards. According to The Inquirer web-site, which claims that it has seen a product change notification by Nvidia, “Nvidia will transition from using Namics 8439-1 underfill material to Hitachi 3730 underfill material for the G86 desktop product” models only.

The reasons that Nvidia reportedly gives for change are claimed to be “to increase supply and enhance package robustness”.

Earlier this year Nvidia admitted that its GeForce graphics processing units (GPUs) and nForce chipsets (which the company calls MCPs, media and communication processors) designed for mobile computers could fail due to issues with high-lead packaging. The company took $196 million charge to help its partners to tackle the problem, however, it said that the issue only affected certain notebook configurations.

But since the company now also changes packaging of its desktop-class products, the problem may be considerably more widespread and may affect certain other GeForce 8 or 9 products as well. According to TG Daily web-site, code-named G84, and G92 GPUs could show failures as well, which would boost the number of candidates for replacement to 70 million. Even though not all of the chips will fail, the problem may be considerably more serious than Nvidia indicated.

Nvidia did not comment on the news-story.

Tags: Nvidia, Geforce, Nforce, Failures

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Monday, August 4, 2014

4:04 pm | HGST Shows-Off World’s Fastest SSD Based on PCM Memory. Phase-Change Memory Power’s World’s Fastest Solid-State Drive

Monday, July 28, 2014

6:02 pm | Microsoft’s Mobile Strategy Seem to Fail: Sales of Lumia and Surface Remain Low. Microsoft Still Cannot Make Windows a Popular Mobile Platform

12:11 pm | Intel Core i7-5960X “Haswell-E” De-Lidded: Twelve Cores and Alloy-Based Thermal Interface. Intel Core i7-5960X Uses “Haswell-EP” Die, Promises Good Overclocking Potential

Tuesday, July 22, 2014

10:40 pm | ARM Preps Second-Generation “Artemis” and “Maya” 64-Bit ARMv8-A Offerings. ARM Readies 64-Bit Cores for Non-Traditional Applications

7:38 pm | AMD Vows to Introduce 20nm Products Next Year. AMD’s 20nm APUs, GPUs and Embedded Chips to Arrive in 2015

4:08 am | Microsoft to Unify All Windows Operating Systems for Client PCs. One Windows OS will Power PCs, Tablets and Smartphones