by Anton Shilov
09/13/2010 | 09:51 PM
DisplayLink Corp. on Monday provided a glimpse at its new SuperSpeed USB (USB 3.0) chip platform for next generation displays, docking stations and other integrated devices to be showcased next week at the Intel Developer Forum in San Francisco, California.
The new DisplayLink single-chip family, DL-3000 and DL-1000 series, includes integrated display and networking connectivity, high performance audio and HD video support, as well as third generation DisplayLink adaptive real-time compression technology that dynamically manages bandwidth, taking full advantage bi-directional throughput of SuperSpeed USB. This means multiple full HD videos, high resolution graphics and networking data can be processed simultaneously, while also substantially increasing today's HighSpeed USB (USB 2.0) graphics performance and enabling graphics delivery over gigabit Ethernet.
“DisplayLink technology has enabled the new category of universal docking stations, in addition to zero clients and other devices that are used by major corporations and educational institutions globally.We look forward to working with our customers to develop a host of next-generation, creative devices that solve real world problems for the digital consumer,” added Dennis Crespo, executive vice president of marketing and business development at DisplayLink.
This new platform will enable a wide range of applications that create an interactive connection between device and display. These include:
SuperSpeed USB is capable of running up to 10 times faster than the previous generation of the technology transferring data at speeds of up to 5Gbps.
Products with integrated DisplayLink DL-3000 and DL-1000 technology are expected to reach the market in the first half of 2011.