News
 

Bookmark and Share

(2) 

Advanced Micro Devices has quietly validated its next-generation core-logic code-named RD790 with PCI special interest group (PCI SIG) which supervises implementations of PCI and PCI Express busses. The validation means that the company may start shipping its first high-end core-logic in years commercially to mainboard makers.

Earlier media reports claimed that AMD’s RD790 north bridge supports HyperTransport 3.0 bus with up to 2.6GHz clock-speed as well as 42 PCI Express 2.0 lanes (two x16 lanes for graphics cards, one x4 lane to connect to I/O controller, one x4 lane for add-in boards and two x1 lanes for add-in cards). AMD RD790 is projected to be compatible with future microprocessors in AM2+ form-factor. The chip itself is rumoured to be made using 65nm process technology at a contract semiconductor manufacturer.

AMD 790, which was originally developed by ATI Technologies, will be AMD’s first high-end core-logic by AMD in years, as previously the company relied on chipsets from companies like ATI (now part of AMD), Nvidia Corp., Silicon Integrated Systems Corp., Via Technologies and so on. The new chipset will support multi-GPU CrossFire technology as well as CrossFire Physics technology and will pose a threat to Nvidia nForce chipsets for AMD platform. It is also likely that the AMD790 will be the base for next-gen AMD QuadFX (4x4) platform.

Currently AMD RD790 is listed in PCI Express Integrators List as a PCI Express 1.1 compliant component.

The PCI-SIG Integrators List includes all products that have a complete and satisfactory PCI Compliance Checklist on file at PCI-SIG, have passed the test criteria set forth at the PCI Compliance Workshops and are production ready. But even though the AMD 790 chipset has been validated by PCI SIG, there is no information when it is planned to be released commercially.

Discussion

Comments currently: 2
Discussion started: 04/06/07 05:28:45 AM
Latest comment: 04/06/07 07:34:18 AM

[1-1]

1. 
hjfghj
0 0 [Posted by:  | Date: 04/06/07 05:28:45 AM]
Reply

[1-1]

Add your Comment




Related news

Latest News

Monday, May 20, 2013

9:57 pm | Western Digital’s HGST Launches Highest Capacity Hard Drive for Notebooks. HGST Unleashes World’s First 2.5”/9.5mm HDD with 1.5TB Capacity

9:31 pm | SanDisk and Toshiba Set to Begin to Produce NAND Flash Using Second-Gen 19nm Process Technology. SanDisk and Toshiba Create World’s Smallest 64Gb NAND Flash Chip

8:42 pm | Samsung Starts Manufacturing of High-Performance SSD for Enterprise Servers and Data Centers. Samsung Begins to Produce Enterprise-Class SSDs

8:10 pm | Nvidia: GeForce GTX Titan Outsold Dual-Chip GeForce GTX 690. In Three Months on the Market, Nvidia’s GeForce GTX Titan Outsold Year-Old GeForce GTX 690

6:43 pm | Futuremark’s PCMark 8 to Benchmark Performance and Power Consumption. Futuremark Announces PCMark 8 Benchmark

6:13 pm | Samsung Display Showcases Retina-Class Displays for Tablets and Notebooks. Samsung Display Shows Off State-of-the-Art Displays