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News
Tuesday, December 1, 2009
Samsung Begins to Produce 3-Bit-per-Cell Flash Memory Using 30nm Process Tech.
Samsung Makes 3-Bit-per-Cell Flash at 30nm Node
Wednesday, November 25, 2009
U.S. Patent Office Again Rejects Rambus’ Claims Against Nvidia.
Nvidia Wins Another Round in Patent Dispute with Rambus
Thursday, November 19, 2009
Elpida Completes Development of 1Gb GDDR5 Chip, Mass Production Scheduled on Q2 2010.
Elpida’s First 1Gb GDDR5 Chips to Work at 6GHz
Tuesday, November 17, 2009
Kingston Initiates Shipments of 12GB Memory Kits for Enthusiasts.
Kingston Begins to Ship 12GB DDR3 Memory Kits
Thursday, November 12, 2009
Taiwan Memory Company Dead on Arrival – Reports.
Taiwanese DRAM Companies Have No Intentions to Merge
Wednesday, November 11, 2009
Elpida and Winbond Explore Manufacturing Partnership.
Elpida and Winbond to Sign Technology-for-Capacity Agreement
Friday, November 6, 2009
Elpida and ProMOS Sign “Technology-for-Capacity” Pact.
Elpida to Outsource Production of DRAM to ProMOS
Thursday, November 5, 2009
Kingston Teams Up with Paramount to Distribute Movies on Flash Cards.
Kingston and Paramount to Deliver Movies on Flash Cards
Wednesday, October 28, 2009
Intel and Numonyx Get One Step Closer Towards Commercialization of Phase Change Memory.
Intel, Numonyx Announce Phase Change Memory Breakthrough
Wednesday, October 21, 2009
Rambus Makes Mobile Memory More Efficient.
Rambus Boasts with Achievements of MMI Test Vehicle
Monday, October 19, 2009
Micron Unveils Flash Memory with Six Times Longer Endurance.
Micron Initiates Production of Improved Flash on 34nm Node
Tuesday, October 13, 2009
SanDisk Initiates Shipments of 4-Bit-per-Cell Flash Memory.
SanDisk Begins Shipments of "X4" MLC Flash
Monday, October 12, 2009
Qimonda to Sell Intellectual Property, May Enable Other Companies to Continue Its Developments.
Qimonda to Sell Portfolio of Its Patents
Thursday, October 8, 2009
Elpida to Make Memory Using 40nm Process Technology.
Elpida Develops 40nm 1600MHz DDR3 DRAM
Friday, October 2, 2009
Specification of Serial Port Memory Technology Gets Finalized.
SPMT Consortium Releases Serial Memory Specification
Monday, September 21, 2009
IBM Develops “World’s Fastest” eDRAM Device.
IBM Creates 32nm SOI eDRAM
Thursday, September 17, 2009
Rambus and Kingston Demonstrate Threaded Memory Modules.
Rambus: Threaded Memory Modules Give 50% Speed Boost, 20% Power Consumption Drop
Friday, September 4, 2009
PowerColor’s Contest Can Point to ATI Radeon HD 5000 Launch Date.
PowerColor to Draw Three DirectX 11 Graphics Cards
Thursday, August 20, 2009
Inspur Acquires Qimonda’s China Operations.
Inspur Gains Qimonda’s R&D Center in China
Monday, August 17, 2009
Flash Manufacturers May Cease to Build New Fabs, Warns Chief Executive of SanDisk.
Chief Executive of SanDisk Makes Eight Predictions for Flash Memory Marker
Friday, August 14, 2009
Samsung Targets Gaming PCs with Solid-State Drives.
Samsung Aims PC Gaming Market with SSDs
Thursday, August 13, 2009
Corsair Memory Adds Speed to High-Capacity USB Flash Drives.
Corsair Unveils High-Performance 128GB Voyager GT Flash Drive
Wednesday, August 12, 2009
Winbond to Manufacture Own-Brand GDDR Memory.
Winbond Becomes Fourth Maker of GDDR in the World
Tuesday, August 11, 2009
Intel, Micron Develop 3-Bits-Per-Cell NAND Flash.
Intel and Micron Enable Higher Density Flash Memory Devices
Friday, August 7, 2009
High-End Dual-Channel Memory Kits Re-Emerge as Lynnfield Gets Near.
Kingston Preps 2133MHz DDR3Memory Modules for Intel’s Next-Gen Chip
Thursday, August 6, 2009
Elpida Enters Graphics Memory Business, Acquires Technologies from Qimonda.
Elpida Inks Deal with Qimonda, Set to Outsource Production to Winbond
Wednesday, August 5, 2009
Qimonda to Be Shut Down by the End of the Year – Reports.
Qimonda Set to Vanish Into Oblivion by 2010
Tuesday, August 4, 2009
Elpida Shows Interest for Graphics Memory Assets of Qimonda.
Elpida Also Interested in Taking Over GDDR Technologies from Qimonda
Toshiba Releases Details About SD Cards to Be Made in 2010
Winbond Wants to Acquire Qimonda’s Technologies to Make GDDR
Thursday, July 30, 2009
Micron Creates “Load Reduced” Memory Modules for Next-Gen Opteron, Xeon Processors.
Micron’s New “Load Reduced” Memory Modules to Boost Memory Capacity of Beckton, Magny Cours-Based Servers
Wednesday, July 29, 2009
Taiwanese DRAM Makers to Bundle DDR2 and DDR3 Memory.
Taiwanese Memory Makers to Sell DDR2 and DDR3 in Bundles
Corsair Unleashes “Special Edition” Memory for AMD Phenom II Processors
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