
News
Thursday, July 2, 2009
Transcend Equips Memory Modules with Thermal Sensors.
Transcend's New Memory Modules Can Monitor Their Temperature
Contract DDR3 Prices to Increase in July
Tuesday, June 30, 2009
Micron Initiates Flash Memory Production Using 34nm Process Technology.
Micron Starts to Produce Flash at 34nm Node
Friday, June 26, 2009
Rambus Demos 7.20GHz XDR Memory Sub-System.
Rambus: 7.20GHz XDR Uses 40% Less Power Than GDDR5
Thursday, June 18, 2009
Samsung Unveils 32GB DDR3 Memory Modules.
Samsung Ships 32GB Registered DIMMs for Servers
Wednesday, June 17, 2009
Patriot Rolls Out “Magnum” 128GB USB Flash Drive.
Patriot Unleashes Monstrous USB Flash Drive
Tuesday, June 16, 2009
OCZ Technology Unveils New Active Cooling Solution for Memory Modules.
OCZ XTC Cooler Revision 2 to Help Memory Modules to Work Faster
Kingston Unleashes Build-to-Order 128GB USB Flash Drive
Monday, June 15, 2009
Rambus to Put a Cap on Its Royalty Rates for Standard DRAM in Europe.
Rambus and European Commission to Agree on DRAM Royalties
Wednesday, June 10, 2009
Corsair Memory Updates Cooling Systems of Memory Modules.
Corsair Unveils DHX+ Cooling Solutions for Memory
Shipments of XDR DRAM Growing, Claims Rambus
Monday, June 8, 2009
Rambus Partly Withdraws Accusations Against Nvidia.
Rambus Moves to Withdraw Patents From ITC Proceedings Against Nvidia
Wednesday, June 3, 2009
OCZ Technology Promises 2.13GHz Memory Modules.
OCZ to Boost DDR3 Memory Speeds Further
Tuesday, June 2, 2009
U.S. Patent and Trademark Office Initially Rejects Rambus’ Charges Against Nvidia.
Patent and Trademark Office: Nvidia Did Not Infringe Rambus’ Patents
Monday, June 1, 2009
Qimonda: The Search for Investor Continues.
Qimonda Continues to Search for Investor
Wednesday, May 27, 2009
Kingston Memory Releases Industry’s First 12GB Memory Kit.
Kingston Launches $1400 Memory Kit for Intel Core i7
Tuesday, May 26, 2009
Rambus Hopes the Industry Adopts Its Technologies for Future-Generations Standard Memory.
Rambus Unveils New Memory Technologies
Monday, May 25, 2009
Patriot Memory Releases Cost-Effective Gaming Memory.
Patriot Announces their G Series Overclocked Gaming Kits!
Thursday, May 21, 2009
Corsair’s Triple-Channel Dominator GT Reaches 2533MHz Clock-Speed – Company.
Corsair’s Triple-Channel Memory Kit Sets World’s Record
Wednesday, May 20, 2009
Memory Makers to Collaborate on Memory Technology for Low-Power Devices.
Serial Port Memory Tech Promises 12.6GB/s Bandwidth, Low Power Consumption
Tuesday, May 19, 2009
JEDEC Publishes First Official Spec for Solid-State Drive.
JEDEC Ratifies Specification for 1.8” SSDs
Monday, May 18, 2009
FTC: Rambus Did Not Obtain Patents Illegally.
Federal Trade Commission Dismisses Case Against Rambus
Thursday, May 14, 2009
Corsair Launches Thermo-Electric, Liquid Cooling Systems for Memory Modules.
Corsair Unveils Advanced Cooling Solutions for Memory Modules
Wednesday, May 13, 2009
Intel: Memory Controller of Core i7 Is Not Broken.
Intel Core i7 Extreme Platform Does Support 1600MHz and Faster Memory
Monday, May 11, 2009
Qimonda Asks Potential Investors to Present Bid By End of May.
Qimonda Faces Liquidation if Potential Investors Do Not Make Bids By End of May
Thursday, May 7, 2009
Patriot Memory Set to Unveil Enthusiast-Class Memory for Notebooks.
Patriot Memory to Release High-Performance Memory Modules for Laptops
Wednesday, May 6, 2009
Hynix, Numonyx and Phison to Jointly Develop NAND Flash Controllers.
Hynix, Numonyx and Phison Join Forces to Boost Market Presence
Corsair Expects High-Capacity Memory Module Kits to Become Increasingly Popular
Monday, April 27, 2009
Toshiba Announces 4GB Flash Chip Made Using 32nm Process Tech.
Toshiba Begins to Make Flash Using 32nm Fabrication Process
Friday, April 24, 2009
Patriot Joins the 2GHz “Core i7” Memory Club.
Patriot Memory Reveals New Viper Memory Modules
Thursday, April 23, 2009
Russian Government to Consider Investment into Qimonda – Reports.
Qimonda May Get Investments from Russia
Wednesday, April 15, 2009
ITC Finds SanDisk’s Lawsuits Against Rivals Partly Unenforceable.
International Trade Commission Finds That Certain SanDisk’s Patents Were Not Infringed
Tuesday, April 14, 2009
Kingston Releases “Extremely Profiled” DDR3 Modules for Notebooks.
Kingston Announces XMP DDR3 HyperX SO-DIMMs
OCZ Unveils Memory Modules Aimed at AMD’s AM3 Platform





