|< Aug, 2012||Oct, 2012 >|
Tuesday, September 25, 2012
JEDEC Publishes DDR4 Memory Standard.
JEDEC Finalizes DDR4 DRAM Specification
Monday, September 24, 2012
Rambus Wins Case Against SK Hynix.
Rambus Entitled to Compensation for Infringement
Wednesday, September 19, 2012
Samsung Begins Mass Production of 128GB NAND Flash Memory for Smartphones and Tablets.
Samsung's 128GB eMMC Memory Hits Mass Production
SK Hynix Launches GDDR3 with Reduced Voltage
Tuesday, September 18, 2012
Micron Appoints Former Nvidia Exec as Vice President of Wireless Solutions Group.
Former Nvidia Tegra Chief Joins Micron to Lead Wireless Solutions Group
Micron Starts to Sell DDR3L-RS Memory for Ultrabooks
Monday, September 17, 2012
Samsung Begins to Produce LPDDR3 Memory Using 30nm-Class Technology.
Samsung Starts Production of 30nm LPDDR3 DRAM
PCs Set to Cease Being Main Consumers of DRAM
Friday, September 14, 2012
SK Hynix Introduces DDR3L Memory with Reduced Standby Power Consumption.
SK Hynix Unveils DDR3L-RS DRAM for Mobile Computers
Wednesday, September 12, 2012
Samsung Demonstrates DDR4 Memory Modules, DDR4 Roadmap.
Samsung Discloses Latest DDR4 Plans at IDF Trade-Show
Tuesday, September 11, 2012
Samsung Starts to Build 10nm NAND Flash Manufacturing Complex in China.
Samsung Breaks Ground for $2.3 Billion NAND Flash Facility in Xi'an, China
Contract Price of 4GB DDR3 Memory Module Drops to $18
Monday, September 10, 2012
Nanya Mulls to Exit Commodity DRAM Business.
Nanya to Concentrate on Special Purpose and Mobile Memory
Cadence Introduces Silicon-Proven 28nm DDR4 Memory Controller and PHY