News Archive

October, 2013
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News

Wednesday, October 30, 2013


SK Hynix Unleashes 6Gb LPDDR3 Memory Chips. SK Hynix  Hynix  LPDDR3  6Gb
[10:57 pm]

SK Hynix Develops LPDDR3 Chips with Non-Standard Capacity

 

Thursday, October 17, 2013


DRAM Makers Prosper Despite of Slow Demand for Personal Computers. DRAM  Business  DDR2  DDR3  Samsung  SK Hynix  Micron  Elpida  Powerchip Semiconductor  Inotera  Nanya
[10:51 pm]

Profits of DRAM Makers Soar to 11-Quarter High – Report

 

Monday, October 14, 2013


SK Hynix Establishes NAND Flash R&D Center in Taiwan. SK Hynix  Hynix  NAND  Flash  LAMD  SSD
[10:10 pm]

SK Hynix to Research and Develop NAND Flash Products in Taiwan

 

Thursday, October 3, 2013


3D Manufacturing Technology – Key to the Future of NAND Flash. NAND  3D NAND  V-NAND  Samsung  Toshiba  SK Hynix  SanDisk  Micron
[10:40 pm]

By 2016, Nearly 50% of NAND Flash to Be Made Using 3D Technology

 

Tuesday, October 1, 2013


JEDEC Doubles Speed of eMMC Interface to 400MB/s. JEDEC  eMMC  Samsung  Toshiba  Micron  NAND  Flash
[10:43 pm]

JEDEC Updates eMMC Spec to Version 5.0