News Archive

April, 2013
 
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News

Monday, April 29, 2013


Samsung Begins Manufacturing of 4Gb LPDDR3 Mobile DRAM. Samsung  DRAM  LPDDR3  20nm
[10:58 pm]

Samsung Initiates 4Gb LPDDR3 Production Using 20nm-Class Process Tech

 

Friday, April 19, 2013


Contract Price of 4GB DDR3 Memory Module Gains $2 in Two Weeks – Market Tracker. DRAM  Business  DDR2  DDR3  Samsung  SK Hynix  Micron  Elpida  Powerchip Semiconductor  Inotera  Nanya
[3:27 pm]

Price of Mainstream Memory Modules May Hit $30 Shortly

 

Wednesday, April 17, 2013


Samsung May Use SK Hynix Memory Chips Inside Its Devices - Company. Samsung  SK Hynix  Hynix  DRAM  LPDDR  Apple  Business
[6:59 pm]

Samsung May Use Rival’s Memory Chips to Boost Output of Smartphones and Tablets

 

Thursday, April 11, 2013


IBM Invests $1 Billion into Development of Flash Memory for Enterprises and Big Data. IBM  NAND  Flash  SSD
[10:20 pm]

IBM to Drive Flash Memory into Growing Big Data Markets

 

Wednesday, April 10, 2013


Samsung Aims SSDs with Mass Production of 128Gb TLC NAND Flash. Samsung  3bpc  TLC  MLC  NAND  Flash  SSD  10nm
[10:10 pm]

Samsung Uses 10nm-Class Process Tech to Make 128Gb TLC NAND Flash Memory

 

Wednesday, April 3, 2013


Hybrid Memory Cube Consortium Publishes Final Specification of HMC Technology. HMC  DRAM  Altera  ARM  Cray  Fujitsu  GlobalFoundries  HP  IBM  Marvell  Micron Technology  National Instruments  Open-Silicon  Samsung  SK Hynix  ST Microelectronics  Teradyne  Xilinx
[10:15 pm]

Specifications of Hybrid Memory Cube Finalized

Contract Price of Commodity DDR3 Memory Up 2% in Two Weeks – DRAMeXchange. DRAM  Business  DDR2  DDR3  Samsung  SK Hynix  Micron  Elpida  Powerchip Semiconductor  Inotera  Nanya
[5:59 pm]

DRAM Price Keeps Growing As Demand Rises Amid Limited Output