At IDF Japan Intel unveiled flash memory products for cell phones with up to five ultra-thin memory chips stacked for greater memory capacity, lower power consumption and optimal space savings. The features of the Intel Ultra-Thin Stacked Chip-Scale Packaging (CSP), featuring 1.8V Intel StrataFlash Wireless Memory, are designed to ease manufacturers' provision of such features as camera capabilities, games and email in relatively thin cell phones.

Earlier Intel Stacked-CSP products were designed and manufactured on a custom basis for manufacturers to offer high-end functionality on their cell phones. Today's announcement marks a new manufacturing approach to bring more stacked products to the market faster using a standard, high-volume manufacturing process. The new standard stacked flash products will enable wireless device makers to easily upgrade their designs with higher flash densities to meet additional memory and performance requirements for their wireless devices.

Intel Stacked-CSP products use a new Intel Ultra-Thin Stacked-CSP package, an advanced wafer thinning and package technology, to obtain lower-profile package heights and more stacking flexibility. By combining 1.8 Volt Intel StrataFlash Wireless Memory with the new Intel Ultra-Thin Stacked-CSP package, Intel can offer extremely small and compelling stacked-product solutions. These advanced stacked-CSP products will allow up to five stacked die with package heights as low as 1.0 mm. The products feature 16-bit and 32-bit buses as well as SRAM, PSRAM and LP-SDRAM options. The products will offer up to 512Mb of flash memory this year and 1Gb of flash memory by next year, to facilitate both code execution and big data applications.

Intel Ultra-Thin Stacked-CSP products featuring 1.8V StrataFlash Wireless Memory are currently sampling, with production volumes starting in third quarter of 2003. Pricing will vary by specific flash and RAM memory combinations.