News
 

Bookmark and Share

(1) 

Japanese memory maker Number One – Elpida Memory – today unveiled samples of its 2GB DDR-II memory modules for server applications. The modules make use of Elpida’s recently unveiled 512Mb DRAMs rated to function at 400MHz and 533MHz.

Elpida’s 2GB PC2-4300 memory modules with ECC support for servers and probably powerful workstations are the world’s fastest high-density DRAM systems that are scheduled for mass production in the Q2 2004. Elpida produces its 512Mb DDR-II chips using 0.11 micron process technology on 300mm wafers in its Japanese fab.

Earlier this year Kingston announced successful verification of memory modules based on Elpida chips. The 256Mb and 512Mb DRAMs clocked at 400 and 533MHz with 3-3-3 and 4-4-4 latency settings, according to PC2-3200 and PC2-4200 standards, have been available for memory module makers for some time now. The products are packaged using 64- or 84-ball FBGA packages and are rated at 1.8V.

It is fairly interesting to note Elpida’s positioning of its newly unveiled 2GB DDR-II modules. Intel’s server chipset code-named Lindenhurst was not meant to support PC2-4300 memory, according to information from a source close to Intel. Therefore, it is not quite clear why Elpida clocks its new products at 533MHz: either the company targets its 2GB modules for a different previously unannounced product, or Intel has changed the specs of its core-logic.

Code-named Lindenhurst chipset is planned to be announced in the first quarter of 2004. As we revealed months ago, this chipset will support 800MHz Quad Pumped Bus, dual-channel PC2700 and PC2-3200 memory, PCI Express x8, PCI Express x4, direct connect LAN and storage components. For Xeon-based workstations Intel will also introduce another new chipset currently code-named as Tumwater with nearly similar feature-set, but adding PCI Express x16 for graphics. Both Lindenhurst and Tumwater are expected to support code-named Nocona processors made using 90nm Strained Silicon technology process.

Discussion

Comments currently: 1
Discussion started: 11/07/03 01:14:55 PM
Latest comment: 11/07/03 01:14:55 PM

Add your Comment




Related news

Latest News

Monday, July 28, 2014

12:11 pm | Intel Core i7-5960X “Haswell-E” De-Lidded: Twelve Cores and Alloy-Based Thermal Interface. Intel Core i7-5960X Uses “Haswell-EP” Die, Promises Good Overclocking Potential

Tuesday, July 22, 2014

10:40 pm | ARM Preps Second-Generation “Artemis” and “Maya” 64-Bit ARMv8-A Offerings. ARM Readies 64-Bit Cores for Non-Traditional Applications

7:38 pm | AMD Vows to Introduce 20nm Products Next Year. AMD’s 20nm APUs, GPUs and Embedded Chips to Arrive in 2015

4:08 am | Microsoft to Unify All Windows Operating Systems for Client PCs. One Windows OS will Power PCs, Tablets and Smartphones

Monday, July 21, 2014

10:32 pm | PQI Debuts Flash Drive with Lightning and USB Connectors. PQI Offers Easy Way to Boost iPhone or iPad Storage

10:08 pm | Japan Display Begins to Mass Produce IPS-NEO Displays. JDI Begins to Mass Produce Rival for AMOLED Panels

12:56 pm | Microsoft to Fire 18,000 Employees to Boost Efficiency. Microsoft to Perform Massive Job Cut Ever Following Acquisition of Nokia