News
 

Bookmark and Share

(0) 

Elpida Memory announced the availability of its 1Gb DDR-II SDRAM device. Elpida’s newest DDR-II devices were shipped to customers on 2GB Registered modules developed by Elpida so that customers can quickly and easily evaluate the new devices on next-generation server platforms.

In early November 2003 Elpida unveiled its 2GB PC2-4300 memory modules with ECC support for mission-critical applications. Those devices were scheduled for mass production in the Q2 2004. 2GB PC2-4300 memory modules were based on Elpida’s 512Gb DDR-II chips product on 0.11 micron node using 300mm wafers.

Elpida’s 533MHz 1Gb DDR-II devices are organized as 256M words x 4-bits (8 banks), and 128M words x 8-bits (8 banks). The devices are produced at Elpida’s 300mm fabrication facility in Hiroshima, and they utilize Elpida’s newly developed 0.10 micron process technology. The chips are packed in 68-ball FBGA package. The devices also feature 1.8V power supply with a CAS latency of 3-4-5 and a burst length of 4, 8. They also offer Off-Chip Driver (OCD) Impedance Adjustment and On-Die termination (ODT) for improved signal quality.

4GB Registered dual in-line memory modules (DIMMs) and 2GB SO-DIMMs based on the new 1Gb device are currently under development and will be available soon, Elpida said.

Operation of those test modules build upon 2Gb DDR-II DRAM was confirmed on Elpida’s server system boards prior to shipping. These modules were provided as a courtesy to customers solely for the purpose of testing Elpida’s 1Gb DDR-II devices.

Elpida’s 1 Gigabit DDR-II device also allows both DDR and DDR-II to be integrated on the same chip, making customer requests for conventional DDR SDRAM easy to achieve by switching between DDR and DDR-II via a metal option during the manufacturing cycle.

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Tuesday, July 15, 2014

6:11 am | Apple Teams Up with IBM to Make iPhone and iPad Ultimate Tools for Businesses and Enterprises. IBM to Sell Business-Optimized iPhone and iPad Devices

Monday, July 14, 2014

6:01 am | IBM to Invest $3 Billion In Research of Next-Gen Chips, Process Technologies. IBM to Fund Development of 7nm and Below Process Technologies, Help to Create Post-Silicon Future

5:58 am | Intel Postpones Launch of High-End “Broadwell-K” Processors to July – September, 2015. High-End Core i “Broadwell” Processors Scheduled to Arrive in Q3 2015

5:50 am | Intel Delays Introduction of Core M “Broadwell” Processors Further. Low-Power Broadwell Chips Due in Late 2014

Wednesday, July 9, 2014

4:04 pm | Intel Readies New Quark “Dublin Bay” Microprocessors. Intel’s “Dublin Bay” Chips Due in 2015